Display Device Light-Emitting Layer Patterning via Common Resist Liftoff
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Solution Overview
Problem
The existing method for manufacturing display devices with multiple light-emitting layers requires a large number of manufacturing process steps and exposes the light-emitting materials to developing solutions and light multiple times, leading to potential deterioration and increased complexity.
Innovation Solution
A method involving the formation of resist layers and light-emitting material layers in a specific pattern, allowing for the simultaneous patterning and lifting off of multiple light-emitting layers, reducing the number of process steps and minimizing exposure to developing solutions and light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If liftoff is performed separately for each color light-emitting layer, then each light-emitting layer can be patterned stably, but the number of manufacturing process steps increases significantly
Solution Approach 1:
The patent combines the patterning operations for multiple light-emitting layers into a single liftoff process. By forming a common resist layer that covers multiple regions and performing one liftoff operation, the patent simultaneously patterns red, green, and blue light-emitting layers, reducing the number of separate process steps while maintaining patterning stability through the unified approach
2Manufacturing precision
If multiple separate liftoff processes are performed, then each light-emitting layer is patterned accurately, but the manufacturing time and process complexity increase
Solution Approach 1:
The patent merges multiple patterning operations into a single liftoff process by using a common resist layer that is formed once and then removed in one step, simultaneously patterning all light-emitting layers. This approach maintains patterning accuracy while significantly reducing the total manufacturing time by eliminating repeated cycle times for resist formation, exposure, development, and liftoff
3Manufacturing precision
If light-emitting materials are exposed to developing solutions and light multiple times, then each layer is formed precisely, but material deterioration occurs
Solution Approach 1:
The patent performs the resist layer formation and patterning operations in advance, before the light-emitting material layers are fully processed. The common resist layer is formed, patterned, and removed in a single sequence, minimizing the number of times the light-emitting materials are exposed to developing solutions and light, thereby reducing material deterioration while maintaining formation precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of manufacturing steps and minimizes material exposure, thereby enhancing the stability and efficiency of the light-emitting layer formation process, potentially improving the reliability and performance of the display device.
Implementation Method 1
patterning the first resist layer by removing, through exposure and development, the first resist layer formed over a first region of the substrate
Implementation Method 2
forming a first light-emitting material layer over the first resist layer patterned, and above the first region of the substrate with the first resist layer removed
Data Source
AI summary
A method for manufacturing a display device includes the following: a) forming a first resist layer over a substrate; b) patterning the first resist layer by removing the first resist layer formed over a first region of the substrate; c) forming a first light-emitting material layer over the first resist layer patterned, and above the first region of the substrate with the first resist layer removed; d) forming a second resist layer over the first light-emitting material layer; e) patterning the second resist layer by removing the first resist layer formed over a second region of the substrate, followed by lifting off the first light-emitting material layer and the second resist layer formed over the first resist layer over the second region; and f) forming a second light-emitting material layer over the second resist layer patterned, and above the second region of the substrate with the first second resist layer removed.