Display Module Light-Shielding Layout for Bezel-Free Low Reflectivity
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Solution Overview
Problem
Existing liquid crystal display panels with no bezel on four sides suffer from high reflectivity due to the array substrate being on the light emitting side, which affects picture quality.
Innovation Solution
The display module includes a conductive light-shielding layer grounded on the first polarizer, covering connection pads and flexible printed circuits in the non-display area, and a normal arrangement of the opposing substrate on the light emitting side, with a first polarizer fully covering the array substrate to reduce reflectivity and provide a bezel-less design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the array substrate is placed on the light emitting side to achieve no bezel design, then the bezel area is reduced, but the reflectivity increases affecting picture quality
Solution Approach 1:
A conductive light-shielding layer is introduced as an intermediary component between the array substrate and the first polarizer. This layer effectively blocks light reflection from the array substrate while maintaining the no-bezel design, thereby resolving the contradiction between reduced bezel area and high reflectivity
Solution Approach 2:
The light-shielding layer is selectively applied only in the non-display area where the array substrate is located, rather than across the entire display panel. This localized approach reduces reflectivity at the problematic area without affecting the overall display area or requiring additional bezel space
2Ease of manufacture
If connection pads and flexible printed circuits are exposed in the non-display area, then the bonding function is achieved, but the appearance and anti-static performance are compromised
Solution Approach 1:
The conductive light-shielding layer serves multiple functions simultaneously: it shields light to reduce reflectivity, provides electrostatic discharge protection by being grounded, and covers the connection pads and flexible printed circuits for a cleaner appearance. This multi-functional design resolves the contradiction between bonding functionality and anti-static performance
3Area of stationary object
If the first polarizer covers the connection pads, then the no bezel design is achieved, but the connection pads need additional shielding for proper function
Solution Approach 1:
The light-shielding function and the electrostatic discharge protection function are merged into a single conductive light-shielding layer. This integrated structure eliminates the need for separate shielding components, maintaining the no-bezel design while reducing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces reflectivity and improves anti-static performance by shielding the bonding area, enhancing the appearance and stability of the display module.
Implementation Method 1
A conductive light-shielding layer is provided on a side of the first polarizer closer to the array substrate, the conductive light-shielding layer is disposed in the non-display area, the conductive light-shielding layer covers the one or more connection pads and the first bonding portion of each flexible printed circuit
Implementation Method 2
the conductive light-shielding layer is configured to be grounded
Implementation Method 3
improves the anti-static performance by shielding the bonding area
Data Source
AI summary
A display module, where an opposing substrate is disposed on a light emitting side of the display module; a first polarizer is disposed on a side of the opposing substrate away from an array substrate and covers one or more connection pads; a second polarizer is disposed on a side of the array substrate away from the opposing substrate; a conductive light-shielding layer is provided on the first polarizer, the conductive light-shielding layer covers the connection pad(s) and a first bonding portion of one or more flexible printed circuits, and the conductive light-shielding layer is configured to be grounded.