Display Device Manufacturing Apparatus Temperature Control
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Solution Overview
Problem
The bonding reliability of anisotropic conductive films in display device manufacturing is affected by the temperature, with existing methods struggling to accurately control the pressing temperature in real-time, leading to weakened bonds or excessive power consumption.
Innovation Solution
A display device manufacturing apparatus that includes a heater, a pressing member, and a temperature measuring member to control the bonding process by measuring the internal temperature of a housing cover, ensuring the pressing temperature of the anisotropic conductive film is within a reference range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the pressing temperature of the anisotropic conductive film is increased to improve bonding reliability, then bonding strength is improved, but power consumption increases and temperature control becomes difficult
Solution Approach 1:
The patent implements real-time temperature measurement within the pressing member using a temperature sensor that directly monitors the temperature at the bonding interface. This feedback mechanism allows the control system to adjust heating power dynamically, maintaining optimal bonding temperature while preventing excessive power consumption and ensuring consistent bonding reliability.
Solution Approach 2:
The patent replaces indirect temperature estimation methods with direct temperature sensing within the pressing member. By embedding a temperature sensor in the pressing member that directly contacts or is adjacent to the anisotropic conductive film, the system obtains accurate real-time temperature data without relying on mechanical assumptions or external measurements.
2Reliability
If the pressing temperature is not accurately controlled, then manufacturing process is simpler, but bonding reliability deteriorates
Solution Approach 1:
The patent incorporates a temperature sensor within the pressing member that provides real-time temperature feedback to a control system. This enables closed-loop temperature control, ensuring the anisotropic conductive film is heated to the precise temperature required for reliable bonding, while the control system automatically adjusts heating parameters to maintain optimal conditions.
Solution Approach 2:
The patent uses the pressing member as an intermediary that integrates both heating and temperature sensing functions. The pressing member acts as a mediator between the heat source and the anisotropic conductive film, while the embedded temperature sensor provides direct temperature measurement at the bonding interface, simplifying the overall control architecture.
3Measurement precision
If real-time temperature measurement is implemented to control bonding process, then bonding reliability is improved, but device complexity increases
Solution Approach 1:
The pressing member serves as an intermediary structure that integrates the temperature sensor within its body. This placement allows direct temperature measurement at the bonding interface between the anisotropic conductive film and the substrate, providing precise real-time temperature data without requiring separate measurement apparatus or complex external sensing systems.
Solution Approach 2:
The patent combines the heating function and temperature measurement function within a single integrated pressing member structure. By embedding the temperature sensor within the pressing member that also applies heat and pressure, the system achieves precise temperature monitoring and control without adding separate independent systems, thereby reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves bonding reliability by maintaining the pressing temperature within optimal ranges, preventing weakened bonds and excessive power consumption, thereby enhancing the manufacturing process efficiency.
Implementation Method 1
a heater which generates heat; a pressing member at which the display device manufacturing apparatus contacts a target object of a display device to transfer the heat to the target object; a body connected to each of the heater and the pressing member and through which the heat from the heater is provided to the pressing member
Data Source
AI summary
An apparatus for manufacturing a display device, includes: a heater which generates heat; a pressing member which contacts a target object of a display device to transfer the heat to the target object; a body connected to each of the heater and the pressing member and through which the heat from the heater is provided to the pressing member; and a first housing cover extended from the body to surround the pressing member and the body in a plan view. Engagement of the first housing cover with the target object defines an internal space of the first housing cover having a temperature, and measurement by the apparatus, of the temperature of the internal space, controls bonding of layers of the target object to each other.