Display Deposition Mask Assembly for Pixel Position Accuracy
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Solution Overview
Problem
Existing mask assemblies for display apparatus manufacturing face challenges in achieving precise pixel position accuracy and deposition yield due to issues with mask adhesion and deposition material distribution, leading to reduced accuracy and efficiency in forming electrodes and emission layers.
Innovation Solution
A mask assembly design featuring a mask frame with a non-opening region of specific width and thickness, surrounded by a support stick and welding regions, allows for improved deposition material control and pixel position accuracy through strategic welding corrections, enabling precise deposition on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the mask assembly uses a conventional design without optimized non-opening region, then the structure is simpler, but pixel position accuracy deteriorates due to repulsive forces and wave generation during deposition
Solution Approach 1:
The mask assembly implements local quality by creating a non-opening region with specific dimensions (200-500 μm width) and reduced thickness (half-etched) at the boundary between deposition and non-deposition areas. This localized structural modification prevents repulsive forces and wave generation during material deposition, thereby improving pixel position accuracy without requiring comprehensive redesign of the entire mask structure.
Solution Approach 2:
The mask assembly segments the mask body into distinct functional regions: a deposition region with openings for material transmission and a non-opening region with reduced thickness to prevent harmful physical effects. This segmentation allows the deposition region to maintain high material transmission efficiency while the non-opening region specifically addresses pixel position accuracy by eliminating repulsive forces and wave generation at the boundaries.
2Productivity
If the mask assembly uses a conventional design without optimized non-opening region, then the manufacturing process is simpler, but deposition yield deteriorates due to repulsive forces affecting material distribution
Solution Approach 1:
The mask assembly applies parameter changes by modifying the thickness parameter of the non-opening region (reducing it to half the thickness of the deposition region through half-etching). This parameter change alters the physical properties at the mask boundary, preventing repulsive forces that would otherwise cause material distribution defects and reduce deposition yield, while maintaining compatibility with existing mask manufacturing processes.
Solution Approach 2:
The mask assembly implements preliminary action by pre-configuring the non-opening region with reduced thickness before the deposition process begins. This preliminary structural preparation ensures that repulsive forces and wave generation are prevented from the outset during material deposition, thereby guaranteeing high deposition yield without requiring complex real-time adjustments or additional manufacturing steps.
3Manufacturing precision
If the mask assembly uses a conventional design without support stick, then the device structure is simpler, but mask adhesion deteriorates leading to reduced deposition accuracy
Solution Approach 1:
The mask assembly introduces a support stick as an intermediary element between the mask body and the mask frame. This support stick serves as a mediator that enhances mask adhesion and positional stability during the deposition process, preventing mask displacement that would compromise deposition accuracy. The support stick is strategically positioned to provide mechanical support without interfering with the deposition region or the optimized non-opening region functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances pixel position accuracy and deposition yield by preventing repulsive forces and wave generation, allowing for effective deposition on the substrate and improving the overall manufacturing process of display apparatuses.
Implementation Method 1
a deposition source arranged in the chamber and configured to supply a deposition material into the chamber
Data Source
AI summary
Provided is a mask assembly including a mask frame including an opening; and a mask arranged on the mask frame and including a deposition region and a non-opening region arranged around the deposition region, the deposition region facing the opening to transmit a deposition material. A width of the non-opening region in a lengthwise direction of the mask is about 200 μm to about 500 μm.