Multi-Layer Metal Structure for Display Signal Resistance
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Solution Overview
Problem
Current display devices face challenges in reducing signal resistance while maintaining a thin profile and improving reliability, particularly in the non-display areas of light-emitting diode (LED) displays, which affects image quality and efficiency.
Innovation Solution
The implementation of a metal layer with a thickness of about 6000 to 10,000 angstroms that overlaps the substrate, including a first and second voltage metal layer, and sub-metal layers, which are spaced apart to reduce signal resistance and facilitate the formation of conductive layers, thereby improving image quality and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal layer is added to reduce signal resistance, then electrical conductivity is improved, but device complexity increases
Solution Approach 1:
The patent implements a nested multi-layer metal structure where a first metal layer is disposed on the substrate and a second metal layer is disposed on the first metal layer. This nesting approach reduces signal resistance by providing multiple parallel conduction paths while maintaining a compact integrated structure that does not significantly increase overall device complexity.
Solution Approach 2:
The patent transitions from a single-layer to a multi-layer metal structure by adding vertical dimensionality. The second metal layer is positioned above the first metal layer, creating a three-dimensional conductive network that reduces signal resistance without expanding the horizontal footprint of the device.
2Reliability
If the metal layer thickness is increased to reduce resistance, then electrical conductivity is improved, but the overall thickness of the display device increases
Solution Approach 1:
Instead of increasing the thickness of a single metal layer, the patent distributes the conductive function across multiple thinner layers stacked vertically. The first and second metal layers each have controlled thicknesses that, when combined, provide the necessary conductivity while keeping the total thickness increase minimal and manageable.
Solution Approach 2:
The patent divides the metal layer into multiple segments (first metal layer and second metal layer) with distinct functions and thicknesses. This segmentation allows each layer to be optimized independently for conductivity and thickness, achieving low resistance without excessive overall thickness.
3Ease of manufacture
If openings are defined in the metal layer to facilitate conductive layer formation, then ease of manufacture is improved, but the metal layer continuity is disrupted
Solution Approach 1:
The patent strategically segments the metal layer by defining openings that allow underlying conductive layers to be formed and connected. These openings are positioned to enable necessary electrical connections while maintaining sufficient metal layer continuity in other regions to preserve structural integrity and electrical conductivity.
Solution Approach 2:
The patent applies local quality by creating openings only in specific regions where conductive layer formation is required, while maintaining the continuous metal layer structure in other critical areas. This localized modification achieves manufacturing facilitation without compromising overall metal layer stability.
Data Source
AI summary
A display device includes a substrate, a metal layer disposed on the substrate, a first conductive layer including a lower pattern disposed on the metal layer, an active layer disposed on the first conductive layer, a second conductive layer disposed on the active layer and including a first gate electrode, a pixel electrode disposed on the second conductive layer, and an emission layer and a common electrode disposed on the pixel electrode.