Display Encapsulation with Metal Particle Surface Layer for Heat Dissipation
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Solution Overview
Problem
Display apparatuses face issues with external impact damage and heat dissipation efficiency due to the use of high-strength metals with low thermal conductivity, which degrade image quality and shorten device lifespan.
Innovation Solution
A display apparatus design featuring a metal encapsulation substrate with a surface particle layer made of metal particles dispersed at its surface, where the surface particle layer has a higher thermal conductivity than the substrate, enhancing both impact resistance and heat dissipation by increasing the surface roughness and thermal conductivity gradient.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal encapsulation substrate with high strength is used to block external impacts, then impact resistance is improved, but thermal conductivity deteriorates
Solution Approach 1:
The invention uses a composite structure consisting of a metal encapsulation substrate and a surface particle layer made of metal particles. The metal substrate provides high strength for impact resistance, while the metal particle layer with higher thermal conductivity enhances heat dissipation. This composite material approach resolves the contradiction by combining materials with complementary properties.
Solution Approach 2:
The surface particle layer is applied specifically on the surface of the metal encapsulation substrate, creating a localized region with enhanced thermal conductivity. This allows the bulk metal substrate to maintain its high strength properties while the surface layer addresses the heat dissipation issue,实现ing local optimization of different properties.
2Loss of energy
If the surface particle layer thermal conductivity is increased to improve heat dissipation, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The invention changes the thermal conductivity parameter by selecting metal particles with inherently high thermal conductivity properties. Rather than complex multi-layer structures, the solution simplifies the approach by using particles whose material parameter (thermal conductivity) naturally provides the desired heat dissipation enhancement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents damage from external impacts and improves heat dissipation efficiency, leading to enhanced image quality and extended device lifespan by ensuring better bonding and heat transfer.
Implementation Method 1
The surface particle layer has a thermal conductivity that is higher than the encapsulation substrate. Heat generated by the operation of the light-emitting device may be emitted through the encapsulation substrate.
Data Source
AI summary
A display apparatus can include at least one light-emitting device on a device substrate, an encapsulating element on the device substrate and covering the light-emitting device, an encapsulation substrate on the encapsulating element and including a metal, and a surface particle layer surrounding at least a portion of the encapsulation substrate. The surface particle layer can include metal particles dispersed at a surface of the encapsulation substrate. The surface particle layer can have a thermal conductivity that is higher than a thermal conductivity of the encapsulation substrate.