Multi-Layer Metal Conductive Stack for Display Device Film Detachment
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Solution Overview
Problem
Existing display devices face reliability issues in high temperature and high humidity environments due to detachment of films at the interfaces of metal layers.
Innovation Solution
A display device with a support layer containing a polymer resin and a lower conductive layer comprising a stack of first, second, and third metal layers, where the first and third metal layers contain nickel (Ni) and vanadium (V), and the second metal layer contains silver (Ag), improving bonding forces and surface roughness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional metal layer structure is used in the lower conductive layer, then the display device can be manufactured with standard processes, but film detachment occurs at the interfaces of metal layers in high temperature and high humidity environments
Solution Approach 1:
The patent applies composite materials by creating a multi-layer metal structure where the first metal layer contains nickel and vanadium, the second metal layer contains silver, and the third metal layer contains nickel. This composite structure combines different metal properties to achieve both electrical conductivity and enhanced bonding strength, preventing film detachment in harsh environments.
Solution Approach 2:
The patent changes the compositional parameters of the metal layers by incorporating vanadium at specific concentrations (1-10 at%) in the nickel-based layers. This parameter modification alters the material properties to improve bonding strength and resistance to environmental factors, directly addressing the film detachment issue.
2Strength
If the first metal layer contains nickel and vanadium with specific composition ratios, then bonding strength and surface roughness are improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent specifies precise parameter ranges for vanadium content (1-10 at%) and layer thicknesses (first metal layer: 60-120 nm, second metal layer: 100-200 nm, third metal layer: 60-120 nm). By defining these parameters within acceptable ranges rather than requiring exact values, the patent maintains manufacturing precision requirements at manageable levels while still achieving the desired bonding strength improvement.
3Strength
If the lower conductive layer has increased surface roughness of about 1500 nm to about 3000 nm, then bonding force is enhanced, but surface finish quality deteriorates
Solution Approach 1:
The patent deliberately changes the surface roughness parameter to fall within the range of 1500 nm to 3000 nm, which is higher than conventional smooth surfaces but still controllable. This parameter modification is achieved through the specific metal layer composition and deposition process, and it provides sufficient bonding force while maintaining acceptable surface finish quality for display device manufacturing.
Data Source
AI summary
A display device is divided into a deformable part which is foldable or rollable and a non-deformable part disposed adjacent to the deformable part. The display device may include a support layer containing a polymer resin, a lower conductive layer disposed on the support layer and having a first metal layer, a second metal layer, and a third metal layer stacked in sequence, and a display panel disposed on the lower conductive layer. The first metal layer may contain nickel (Ni) and vanadium (V), the second metal layer may contain silver (Ag), and the third metal layer may contain nickel (Ni).