Display Device Middle Frame Top Case Integration
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Solution Overview
Problem
The existing display device designs face challenges with increased manufacturing processes and costs due to the need for a cover shield to protect the source printed circuit board (PCB) when it is exposed, and the rigidity of the middle frame is not adequately secured without additional reinforcement brackets, which complicate the structure and add more assembly steps.
Innovation Solution
The display device incorporates a top case that replaces the conventional cover shield, featuring a support portion with an inner sidewall, flange, outer sidewall, fixing bracket, and expansion bracket, which are formed through compression molding and bending operations to enhance rigidity without additional members, and includes a heat dissipation pad for effective heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cover shield is separately provided to protect the source PCB, then the source PCB is protected from damage, but the manufacturing process is complicated and costs increase
Solution Approach 1:
The patent integrates the cover shield function into the middle frame structure itself. The middle frame includes a side surface support portion that extends to cover and protect the source PCB, eliminating the need for a separate cover shield component. This merging of functions reduces the number of parts and simplifies the manufacturing process while maintaining protection reliability.
Solution Approach 2:
The middle frame is designed to serve multiple functions: it provides structural support for the display panel, secures the rigidity of the display device, and simultaneously protects the source PCB through its side surface support portion. This multi-functionality eliminates the need for separate protective components and reduces overall device complexity.
2Strength
If a reinforcement bracket is added to secure the rigidity of the support portion, then the rigidity is improved, but the number of manufacturing processes and assembly steps increase
Solution Approach 1:
The reinforcement bracket is integrated into the middle frame as a single molded structure. The side surface support portion includes built-in reinforcement features formed during the molding process, eliminating the need for separate reinforcement brackets and their associated assembly steps. This reduces manufacturing complexity while maintaining structural rigidity.
Solution Approach 2:
The reinforcement structure is pre-formed as an integral part of the middle frame during the molding process. The side surface support portion is designed with inherent rigidity features that are created in advance during manufacturing, eliminating the need for subsequent reinforcement assembly operations.
3Device complexity
If the source PCB is provided on the side surface of the middle frame, then the need for a cover shield is reduced, but heat dissipation becomes a critical concern
Solution Approach 1:
A heat dissipation pad is introduced as an intermediary component between the source PCB and the middle frame. This pad facilitates thermal transfer from the heat-generating source PCB to the middle frame structure, which acts as a heat sink. This intermediary element enables effective heat dissipation while maintaining the simplified side-mounted configuration.
Solution Approach 2:
The patent replaces complex active cooling systems with a passive thermal conduction approach. Heat dissipation is achieved through thermal conduction via the heat dissipation pad and conduction to the middle frame structure, eliminating the need for active cooling mechanisms while maintaining thermal management effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces manufacturing complexity and costs by eliminating the need for separate cover shields and reinforcement brackets, while ensuring sufficient rigidity and effective heat dissipation, thereby simplifying the assembly process and enhancing the structural integrity of the display device.
Implementation Method 1
a heat dissipation pad that contacts a portion of the inner surface of the top case and a portion of an outer surface of the member layer
Data Source
Figure 1
Figure 2
Figure 3(a)~3(b)
AI summary
Disclosed is a display device provided to solve any problem caused when a source PCB is provided on the lateral rear side or the rear side of a middle frame, to solve any additional problem caused when the source PCB is provided on the side surface of the middle frame, and to ensure rigidity of the middle frame and optimize the number of processes and associated costs. The display device includes a display panel, a middle frame comprising a rear-surface portion located in a rear of the display panel and a support portion configured to form a sidewall on one side edge of the rear-surface portion, a guide panel coupled to the middle frame so as to surround an outer periphery of a side surface of the middle frame, a seating portion provided on the guide panel so as to form a portion of a side surface of the guide panel and surround the support portion, a source PCB seated on an outer surface of the seating portion, a member layer configured to connect one side of the display panel and the source PCB to each other, and a top case configured to cover the seating portion and the side surface of the guide panel and to define a space along with the source PCB.