Display Module Buffer Devices for Signal Reflection Reduction

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Solution Overview

Problem

Large-sized display devices face challenges with signal transmission due to longer signal transmission lines, requiring higher accuracy and reliability to prevent signal reflection and ensure proper display functionality.

Innovation Solution

The display module incorporates buffer devices, such as resistors or LVDS buffers, connected to the ends of differential sub-lines near the chip-on-films, to reduce signal reflection between the differential lines and the chip-on-films.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the display device size is increased to meet large-screen demands, then the display area is improved, but the signal transmission line length increases causing signal reflection and reduced transmission reliability

Engineering Contradiction:
Improvedisplay areaVSAvoidsignal transmission reliability
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

Buffer devices are introduced as intermediary components between the signal transmission lines and chip-on-films. These buffer devices act as mediators that absorb and reduce signal reflections, preventing them from affecting signal transmission quality. The buffer devices are specifically positioned at connection points where signal lines meet chip-on-films, serving as intermediate elements that resolve the conflict between long transmission lines and reliable signal delivery.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If buffer devices are added to reduce signal reflection, then signal transmission reliability is improved, but device complexity increases

Engineering Contradiction:
Improvesignal transmission reliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Buffer devices are not distributed throughout the entire display device but are selectively placed only at critical locations where signal lines connect to chip-on-films. This localized approach ensures that buffer devices are applied precisely where signal reflection problems occur, improving reliability at specific problem points without unnecessarily increasing overall device complexity. The selective placement strategy maintains simplicity in non-critical areas while providing targeted solutions where needed.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The implementation of buffer devices improves signal transmission reliability by minimizing signal reflection, ensuring accurate signal delivery to the display panel, and reducing the risk of display abnormalities.

Implementation Method 1

the buffer device is configured to reduce signal reflection between the first differential line and the chip-on-film

Methodology Applied
Scientific EffectSignal reflection reduction: Electrical Resistance

Data Source

PatentUS12288516B2Display module and display device
Publication Date: 2025.04.29 HEFEI BOE ZHUOYIN TECH CO LTD
  • US12288516B2 patent drawing
  • US12288516B2 patent drawing
  • US12288516B2 patent drawing

AI summary

A display module includes a display panel, at least one bonding circuit board, a plurality of chip-on-films, and a plurality of buffer devices. The at least one bonding circuit board each include first differential lines, and a first differential line includes a P-polarity differential sub-line and an N-polarity differential sub-line. An end of a chip-on-film is connected to the first differential line, and the other end of the chip-on-film is connected to the display panel. The buffer devices are arranged on the bonding circuit board, a buffer device is connected to ends, proximate to the chip-on-film, of the P-polarity differential sub-line and the N-polarity differential sub-line, and the buffer device is configured to reduce signal reflection between the first differential line and the chip-on-film.