Display Module Conductive Protection Layer for Static Discharge
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Solution Overview
Problem
Current display modules in electronic devices, such as mobile phones and computers, are prone to abnormal displays due to interference from static electricity, which can damage the driving chip and lead to bonding failures between the flexible circuit board and the display panel.
Innovation Solution
The display module incorporates a flexible circuit board with a first and second conductive layer, connected through a via hole, and a conductive protection layer covering the driving chip, which is connected to the second conductive layer. This configuration allows static electricity to be conducted to the control circuit board, grounding it and preventing damage to the driving chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional display module structure is used, then the device can display images, but static electricity interference causes abnormal displays and bonding failures
Solution Approach 1:
The patent introduces a conductive protection layer as an intermediary component between the driving chip and the flexible circuit board. This protection layer acts as a mediator that collects static electricity from the driving chip and conducts it to the flexible circuit board, preventing direct static electricity damage to the chip while maintaining the bonding interface integrity
Solution Approach 2:
The patent extracts the static electricity discharge path from the bonding interface area by placing the conductive protection layer on the driving chip surface. This separates the static electricity conduction function from the bonding function, allowing the bonding interface to remain clean and free from static electricity interference
2Object-affected harmful factors
If the conductive protection layer covers the driving chip, then static electricity is conducted away, but the bonding area between flexible circuit board and display panel may be stripped
Solution Approach 1:
The conductive protection layer is designed with non-uniform coverage - it covers the driving chip area where static electricity protection is needed, while deliberately excluding the bonding interface area where bonding strength is required. This local differentiation allows the same component to serve both protection and bonding functions in different regions
Solution Approach 2:
The patent segments the conductive protection layer into a chip-covering portion and a bonding-area portion. The chip-covering portion provides static electricity protection, while the bonding-area portion maintains the bonding interface integrity. This segmentation allows each portion to optimize its function independently
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the risk of abnormal displays by eliminating static electricity interference, ensuring the normal operation of the driving chip, and preventing bonding failures between the flexible circuit board and the display panel.
Implementation Method 1
a conductive protection layer, covering the driving chip and connected to the second conductive layer... the static electricity affecting the driving chip can be conducted to the control circuit board along the path of the conductive protection layer-the second conductive layer-the first conductive layer
Data Source
AI summary
A display module includes a display panel and a peripheral region. The peripheral region includes a bendable fan-out region including a panel bonding portion and a driving chip; a flexible circuit board, including a first and a second conductive layers, and a substrate. The first conductive layer includes a first and a second bonding portions, and a connection portion; the second conductive layer is located on a side of the first conductive layer and at least partially overlaps with the first bonding portion; the first and the second conductive layers are connected through a via hole penetrating through the substrate; an end of the flexible circuit board is bonded to the panel bonding portion through the first bonding portion, and the second bonding portion is bonded to a control circuit board; and a conductive protection layer, covering the driving chip and connected to the second conductive layer.