Display Module Heat Dissipation via FPC Segmentation
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Solution Overview
Problem
The reverse bonding structure in OLED modules, which places a flexible printed circuit reversely on the driver IC, leads to poor heat dissipation due to the driver IC being enclosed in a space.
Innovation Solution
A display module with a heat dissipation structure that includes a heat-conducting metal structure and an electrical-insulating and heat-conducting adhesive layer, which guides heat from the driver IC to the outside of the flexible printed circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the flexible printed circuit is placed reversely on the driver IC to create a reverse bonding structure, then more space is available for the battery compartment, but the driver IC is enclosed in a space that is not conducive to heat dissipation
Solution Approach 1:
The flexible printed circuit is segmented by forming a through hole that penetrates from the first surface to the second surface, creating a heat dissipation channel that divides the enclosed space and allows heat to escape from the driver IC region
Solution Approach 2:
A heat dissipation structure is introduced that extends from within the first accommodating groove to outside the flexible printed circuit in a direction perpendicular to the first surface, creating a three-dimensional heat dissipation pathway that exits through the bonding area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat dissipation structure effectively addresses the poor heat dissipation issue of the driver IC in the reverse bonding structure, ensuring adequate heat dissipation and improving the overall performance of the display module.
Implementation Method 1
a heat dissipation structure extending from within the first accommodating groove to outside the flexible printed circuit is further disposed between the flexible printed circuit and the bonding area
Implementation Method 2
an electrical-insulating and heat-conducting adhesive layer between the heat-conducting metal structure and the driver IC
Data Source
AI summary
A display module is provided, including a display panel and a flexible printed circuit (FPC) bonded to the display panel; the display panel includes a display area and a non-display area disposed at the periphery of the display area, the non-display area includes a bonding area disposed on one side of the display area, and a driver integrated circuit (IC) is disposed in the bonding area; the FPC includes a main body part, an orthographic projection of the main body part onto the display panel is in the bonding area, and a first accommodating groove for accommodating the driver IC is provided in a first surface of the FPC close to the display panel; a heat dissipation structure extending from within the first accommodating groove to outside the FPC is further disposed between the FPC and the bonding area. A display device is further provided.