Display Module Ground-Layer Cooling for Rear Driver IC Heat
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Solution Overview
Problem
Display devices face challenges with heat dissipation, particularly from driver integrated circuits (ICs) on the back of a substrate, which can lead to heat being conducted to the front of the display module, causing inefficiencies and potential damage.
Innovation Solution
A heat dissipation structure is implemented, including a ground layer, heat transfer members, and heat dissipation members, such as thermal interface materials (TIMs) and graphite, to effectively dissipate heat from the driver ICs to the rear surface of the substrate, preventing heat from reaching the front of the display module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If driver ICs are mounted on the rear surface of the substrate, then the display module can achieve self-emissive operation with high luminance and resolution, but heat generated from the driver ICs is conducted to the front surface causing operational inefficiencies and potential damage
Solution Approach 1:
A ground layer is introduced as an intermediary thermal management structure between the driver ICs and the substrate. This ground layer acts as a thermal mediator that captures and dissipates heat laterally, preventing it from conducting to the front surface while allowing the driver ICs to maintain high luminance output
Solution Approach 2:
Heat is extracted from the conventional conduction path by introducing the ground layer that laterally dissipates thermal energy. The ground layer extracts heat at the source (rear surface) before it can propagate to the front surface, effectively removing the harmful thermal conduction pathway
2Area of stationary object
If driver ICs are placed adjacent to each other on the rear surface, then the display module achieves compact design, but heat accumulation increases causing reliability issues
Solution Approach 1:
Multiple ground pads are electrically and thermally connected through the ground layer, merging them into a unified thermal management system. This combined ground structure collectively dissipates heat from multiple adjacent driver ICs, preventing localized heat accumulation while maintaining compact substrate area utilization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat dissipation structure effectively minimizes heat transfer to the front of the display module, enhancing operational efficiency and longevity by managing heat generated from the driver ICs.
Implementation Method 1
a first heat transfer member including a surface in contact with the first ground pad
Implementation Method 2
a first heat dissipation member in contact with a side of the first heat transfer member, and configured to dissipate heat transferred through the first heat transfer member
Implementation Method 3
configured to dissipate heat transferred through the first heat transfer member
Implementation Method 4
The first heat dissipation structure is configured to dissipate heat to the rear surface of the substrate, preventing heat from reaching the front of the display module
Data Source
AI summary
A display module includes a substrate, a ground layer disposed in the substrate, a plurality of self-emissive devices provided on a front surface of the substrate, a first driver integrated circuit (IC) provided on a rear surface of the substrate, and a first heat dissipation structure connected to the ground layer, and including a first ground pad exposed to the rear surface of the substrate. The first heat dissipation structure is configured to dissipate heat to the rear surface of the substrate.