Display Module Heat Dissipation Layers for Driving Chip Thermal Management

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Solution Overview

Problem

Current display modules experience higher temperatures in areas corresponding to driving chips due to slow heat conduction, as heat from the driving chip needs to be transmitted through a substrate, a supporting film, and a reinforcing plate.

Innovation Solution

A display module design featuring a substrate with a first and second substrate connected by a bent substrate, a driving chip on the first substrate, a first backplane, a reinforcing layer, a first heat dissipation layer, a second heat dissipation layer between the first heat dissipation layer and the substrate, and a second backplane, where the second heat dissipation layer is connected to the first heat dissipation layer to facilitate quick heat distribution across the panel.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If heat conduction path includes substrate, supporting film, and reinforcing plate, then structural integrity is maintained, but heat conduction speed decreases

Engineering Contradiction:

Improvestructural integrityVSAvoidheat conduction speed

Core Design Contradiction:

StrengthVSSpeed

Solution Approach 1:

The heat dissipation system is segmented into multiple independent heat dissipation layers (first heat dissipation layer, second heat dissipation layer, third heat dissipation layer) positioned at different locations. Each layer independently conducts heat away from the driving chip through different paths, reducing the thermal resistance of the overall heat conduction system while maintaining structural integrity through the reinforcing plate and supporting film.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces heat dissipation in the vertical dimension by stacking multiple heat dissipation layers at different heights and positions. The first heat dissipation layer is positioned near the driving chip, the second heat dissipation layer is positioned at a higher location, and the third heat dissipation layer is positioned at an even higher location. This multi-dimensional heat dissipation approach allows heat to be conducted away from the chip through multiple simultaneous paths, significantly improving heat conduction speed without compromising the structural integrity provided by the reinforcing plate and supporting film.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If driving chip is positioned on first substrate away from second substrate, then display module functionality is improved, but heat dissipation becomes more difficult

Engineering Contradiction:

Improvedisplay module functionalityVSAvoiddriving chip temperature

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces intermediary heat dissipation layers between the driving chip and the external environment. The first heat dissipation layer acts as an intermediary near the driving chip, the second heat dissipation layer acts as an intermediary at a higher position, and the third heat dissipation layer acts as an intermediary at an even higher position. These intermediary layers facilitate efficient heat transfer from the driving chip to the surrounding environment, effectively managing the heat dissipation challenge posed by the driving chip's position on the first substrate away from the second substrate.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design allows for efficient heat dissipation from the driving chip, reducing temperatures in areas corresponding to the driving chips by directly transmitting heat from the second heat dissipation layer to the first heat dissipation layer and distributing it throughout the panel.

Implementation Method 1

heat of a driving chip needs to be transmitted to a heat conducting layer through a substrate, a first supporting film, and a reinforcing plate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11419248B2Display module and display device including heat dissipation layers

Publication Date: 2022.08.16 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD

AI summary

The present invention provides a display module and a display device. By disposing a second heat dissipation layer between a first heat dissipation layer and a first substrate, and connecting the first heat dissipation layer with the second heat dissipation layer, heat in a driving chip is transmitted to the second heat dissipation layer and then directly transmitted to the first heat dissipation layer, thereby the display module allows the heat to be quickly distributed throughout the panel and reducing the temperature in the areas corresponding to the driving chip. Therefore, the present invention solves the technical problem that areas corresponding to driving chips have higher temperature when current display modules are in operation.