Display Module Heat-Spreading Structure for Inorganic LED Panels

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Solution Overview

Problem

Existing display technologies, such as liquid crystal panels and organic light-emitting diode panels, suffer from slow response times, high power consumption, and the burn-in phenomenon, while inorganic light-emitting device panels offer improved luminance, resolution, and durability but require effective heat dissipation solutions.

Innovation Solution

A display module configuration featuring a substrate with mounted inorganic light-emitting devices, a metal plate for heat dissipation, and an adhesive layer with specific thermal and ductility properties, along with a flexible film connection to a driving circuit board, enhances heat dissipation and rigidity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a metal plate is added to the substrate for heat dissipation, then heat dissipation performance is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoiddevice complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the heat dissipation function with the existing substrate structure by integrating a metal plate directly onto the substrate. This merging approach allows the substrate to serve dual purposes: as the mounting base for inorganic light emitting devices and as a heat dissipation component through the attached metal plate, thereby improving heat dissipation without proportionally increasing device complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate is designed to perform multiple functions simultaneously: it serves as the mounting surface for inorganic light emitting devices, provides structural support, and acts as a heat dissipation pathway through the integrated metal plate. This multi-functionality reduces the need for separate dedicated heat dissipation components, thus improving thermal management while controlling overall device complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Stability of the object's composition

If an adhesive layer with high ductility is used between substrate and metal plate, then thermal expansion mismatch is resolved, but manufacturing precision becomes more difficult to control

Engineering Contradiction:

Improvethermal expansion compatibilityVSAvoidmanufacturing precision

Core Design Contradiction:

Stability of the object's compositionVSManufacturing precision

Solution Approach 1:

The patent selects an adhesive layer with specific material parameters, particularly high ductility, to accommodate the thermal expansion coefficient mismatch between the substrate and metal plate. By changing the adhesive's physical properties (choosing a material with appropriate ductility), the system can absorb thermal expansion differences without compromising the overall assembly precision or causing delamination during temperature variations

Inventive Principle:

Principle #35Parameter changes

3Temperature

If the substrate area is made equal to or greater than the metal plate area, then heat dissipation efficiency is improved, but device size increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice size

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The patent applies local quality by concentrating the metal plate specifically in the heat-generatec region beneath the inorganic light emitting devices on the substrate. The substrate area is extended only where necessary to accommodate the metal plate and provide adequate heat dissipation pathways, rather than uniformly increasing the entire device area. This localized approach improves heat dissipation efficiency while minimizing the overall device footprint

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively dissipates heat and maintains structural integrity, improving the performance and longevity of inorganic light-emitting device panels by ensuring uniform heat distribution and reducing the risk of burn-in.

Implementation Method 1

an adhesive layer provided between the rear surface of the substrate and the metal plate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a metal plate facing the rear surface... configured to dissipate heat generated from the substrate

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 3

a coefficient of thermal expansion of the substrate may be less than a coefficient of thermal expansion of the metal plate, and a ductility of the adhesive layer may be greater than a ductility of the substrate and a ductility of the metal plate

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12451469B2Display module and display apparatus including the same

Publication Date: 2025.10.21 SAMSUNG ELECTRONICS CO LTD

AI summary

A display module includes a substrate included a mounting surface on which a plurality of inorganic light emitting devices is mounted and a rear surface opposite the mounting surface, a metal plate facing the rear surface, and an adhesive layer provided between the rear surface of the substrate and the metal plate. An area of the substrate is equal to or greater than an area of the metal plate, the adhesive layer has an area corresponding to an area in which the metal plate faces the substrate, a coefficient of thermal expansion of the substrate is less than a coefficient of thermal expansion of the metal plate, and a ductility of the adhesive layer is greater than a ductility of the substrate and a ductility of the metal plate.