Display Module Heater Control for Thin Protective Film Bumps

The patent applies parameter changes by controlling the heating temperature and duration to precisely control the thickness of the bumps formed on the protective film. By adjusting these parameters, the bump thickness is optimized to achieve the desired bending characteristics while preventing excessive thickness that would cause interference.

The patent implements local quality by applying heat selectively to specific areas of the protective film where bumps are needed. The heating is localized rather than uniform, creating bumps only in the necessary regions to achieve proper bending characteristics while leaving other areas unaffected.

The patent introduces an intermediary approach by positioning the heater at a controlled distance from the protective film rather than direct contact. This intermediate positioning allows heat to be transferred efficiently enough to form bumps while preventing excessive heat input that would result in overly thick bumps.

The patent applies preliminary action by pre-positioning the heater at the optimal distance and controlling the heating parameters before the actual bump formation process. This preliminary setup ensures that when heating occurs, the bump thickness is precisely controlled from the start, preventing excessive thickness.

The patent uses parameter changes to optimize the bump thickness to a precise value that balances two requirements: thin enough to prevent interference but thick enough to provide proper bending characteristics. By carefully adjusting heating parameters, the optimal thickness is achieved.

The patent implements feedback control by monitoring the bump formation process and adjusting heating parameters in real-time. This feedback mechanism ensures that the bump thickness reaches the optimal value without exceeding it, maintaining both thin enough to prevent interference and thick enough for proper bending.