Display Module Assembly With Metal Plate Heat Dissipation
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Solution Overview
Problem
Existing display technologies, such as liquid crystal panels and OLED panels, suffer from slow response times, high power consumption, and the burn-in phenomenon, while LED panels using inorganic light emitting devices offer improved luminance, resolution, and durability but require effective heat dissipation solutions.
Innovation Solution
A display module design incorporating a substrate with mounted inorganic light emitting devices, a metal plate for heat dissipation, and an adhesive layer with specific thermal and ductility properties, along with a flexible film connection to a driving circuit board, enhances heat dissipation and rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal plate is added for heat dissipation, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The patent combines the heat dissipation function with the existing substrate structure by integrating a metal plate into the substrate assembly. The metal plate is positioned at the rear surface of the substrate and coupled through an adhesive layer, merging thermal management functionality with the structural component rather than adding a completely separate system.
Solution Approach 2:
The metal plate serves multiple functions: it acts as a heat dissipation component for the inorganic light emitting devices, provides structural support to the substrate, and contributes to the overall rigidity of the display module. This multi-functionality reduces the need for additional separate components.
2Quantity of substance
If the substrate area is increased to accommodate more devices, then device density is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the display module into standardized substrate units, each containing a specific array of inorganic light emitting devices. These modular substrate units can be manufactured with consistent precision and then assembled into larger display configurations, making the manufacturing process more manageable despite the overall large area.
Solution Approach 2:
The patent specifies that the substrate area is equal to or greater than the metal plate area, establishing a clear geometric parameter relationship. This parameter definition simplifies the manufacturing process by providing clear design criteria for the relative sizing and positioning of key components.
3Temperature
If different materials with different thermal expansion coefficients are used, then functional performance is improved, but reliability decreases due to thermal stress
Solution Approach 1:
The patent introduces an adhesive layer as an intermediary component between the substrate and the metal plate. This adhesive layer acts as a buffer that can accommodate the differential thermal expansion between the glass substrate (lower thermal expansion coefficient) and the metal plate (higher thermal expansion coefficient), reducing thermal stress and preventing delamination or cracking during temperature cycles.
Solution Approach 2:
The patent explicitly acknowledges the difference in thermal expansion coefficients between the substrate and metal plate materials. By designing the assembly with this thermal expansion difference in mind and using the adhesive layer as a compliant interface, the system accommodates thermal cycling without compromising reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat and maintains structural integrity, addressing the limitations of previous technologies by improving luminance, resolution, and durability while preventing burn-in.
Implementation Method 1
an adhesive layer provided between the rear surface of the substrate and the metal plate
Implementation Method 2
a metal plate facing the rear surface
Data Source
AI summary
A display module includes a substrate included a mounting surface on which a plurality of inorganic light emitting devices is mounted and a rear surface opposite the mounting surface, a metal plate facing the rear surface, and an adhesive layer provided between the rear surface of the substrate and the metal plate. An area of the substrate is equal to or greater than an area of the metal plate, the adhesive layer has an area corresponding to an area in which the metal plate faces the substrate, a coefficient of thermal expansion of the substrate is less than a coefficient of thermal expansion of the metal plate, and a ductility of the adhesive layer is greater than a ductility of the substrate and a ductility of the metal plate.