Ultrathin Display Module Mold Frame Protrusion Design
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Solution Overview
Problem
Conventional display modules have non-uniform thickness due to external printed circuit board assemblies, leading to bulkier and less aesthetically pleasing designs, which complicates packaging and increases manufacturing costs.
Innovation Solution
An ultrathin display module design that internalizes the printed circuit board assembly within the display module, eliminating the need for a back plate and using a mold frame with protrusions to create a uniform thickness, supported by a packaging cover and circular polarizer, with a novel assembly structure that reduces overall thickness and simplifies manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the printed circuit board assembly is placed externally on the display module, then the assembly structure is simple, but the thickness becomes non-uniform and the module becomes bulkier
Solution Approach 1:
The patent merges the printed circuit board assembly with the display module by placing it within the peripheral area of the display substrate, integrating two previously separate components into a unified structure. This eliminates the need for external mounting and achieves uniform thickness throughout the module.
Solution Approach 2:
The printed circuit board assembly is nested within the peripheral area of the display substrate, fitting inside the existing structure rather than being mounted externally. This nesting approach allows the PCB assembly to be contained within the display module's footprint, maintaining uniform thickness.
2Stability of the object's composition
If a back plate is used to support the external printed circuit board assembly, then the assembly is stable, but the overall thickness increases and aesthetics deteriorate
Solution Approach 1:
The patent extracts and eliminates the back plate from the display module structure. By integrating the printed circuit board assembly within the display substrate's peripheral area, the separate back plate component becomes unnecessary, reducing overall thickness while maintaining structural stability through the integrated design.
Solution Approach 2:
The support function previously provided by the back plate is merged into the display substrate and peripheral area structure. The substrate itself provides the necessary support for the integrated PCB assembly, eliminating the need for a separate back plate and reducing overall thickness.
3Ease of manufacture
If the printed circuit board assembly is placed externally, then manufacturing is simpler, but packaging becomes more complex and costs increase
Solution Approach 1:
By merging the printed circuit board assembly with the display substrate in a single integrated structure, the patent simplifies packaging requirements. The unified structure with uniform thickness can be packaged more efficiently compared to separate components requiring individual protection and alignment, reducing packaging complexity and costs.
4Device complexity
If external assembly is used, then component separation is clear, but the product appearance is less aesthetic
Solution Approach 1:
The patent merges the printed circuit board assembly into the display substrate's peripheral area, creating a unified, sleek structure with uniform thickness. This integrated design eliminates the visual discontinuity caused by external assemblies and back plates, significantly improving appearance aesthetics while maintaining clear functional separation through spatial arrangement.
Data Source
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Figure 3
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AI summary
A display module (20) comprising: a display substrate (112) having a display area and a peripheral area surrounding the display area; a packaging cover (213) facing the display substrate (112); and a mold frame (220) having a frame shape and configured to receive the display substrate (112) and the packaging cover (213). In the present display module (20), the mold frame (220) includes a main body (220a) and a protrusion (220b) protruding away from an inner surface (220s) of the mold frame (220), the protrusion (220b) is between the display substrate (112) and the packaging cover (213); the packaging cover (213) has a recess (213r) in an area corresponding to the protrusion (220b) for receiving the protrusion (220b); the recess (213r) and the protrusion (220b) complementarily match each other; and the protrusion (220b) has a first surface 220s3) abutting the peripheral area of the display substrate (112) and a second surface (220s4) opposite to the first surface (220s3), the second surface (220s4) abutting a surface of the recess (213r).