Display Module NFC Antenna Integration Without Added Thickness

The patent combines the NFC antenna radiation structure and receiving structure directly into the bonding region of the display module, merging the antenna function with the existing bonding structure. This eliminates the need for separate antenna components attached to the phone shell, thereby achieving the antenna function without increasing phone thickness.

The bonding region structure is designed to serve multiple functions: it provides the bonding connection between display substrate and flexible printed circuit board, and simultaneously houses the NFC antenna radiation structure and receiving structure. This multi-functionality allows the same structural region to fulfill both mechanical bonding and electromagnetic radiation/reception functions without adding extra thickness.

The bonding impedance test circuit is designed to serve dual purposes: it performs the original function of bonding impedance testing during manufacturing, and simultaneously functions as the NFC antenna circuit during operation. The radiation structure and receiving structure are integrated into this existing circuit path, allowing the same circuit to fulfill both testing and antenna functions without requiring separate dedicated antenna circuits.

The bonding impedance test circuit is made self-sufficient by integrating both the radiation structure and receiving structure directly into it. The circuit uses its own existing impedance testing pathway to achieve NFC antenna functionality, eliminating the need for separate antenna circuits or additional components. The circuit serves itself as both the testing mechanism and the antenna system.