Display Module Pin-Pair Layout for Stable FPC Bonding
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Solution Overview
Problem
In silicon-based OLED display apparatuses, the bonding process between the flexible printed circuit (FPC) and the display panel is inefficient, leading to challenges in signal transmission and potential mechanical instability.
Innovation Solution
A display module design with a first and second bonding component, featuring test and function pins arranged in a specific direction, along with dummy pins and an adhesive layer for secure bonding, ensuring effective signal transmission and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the FPC and display panel are bonded together for signal transmission, then signal transmission is enabled, but bonding efficiency is low and mechanical instability occurs
Solution Approach 1:
The bonding structure is segmented into multiple pin pairs (test pin pairs and function pin pairs) arranged in parallel, allowing simultaneous bonding operations across multiple points. This segmentation enables parallel processing of bonding tasks, improving overall bonding efficiency while maintaining reliable connections through each individual pin pair.
Solution Approach 2:
Dummy pins are added at the ends of the pin row to perform preliminary protective action. These dummy pins prevent mechanical stress and potential damage to the actual test and function pins during bonding and subsequent operations. By preparing the bonding structure in advance with protective dummy pins, the reliability of the actual functional pins is enhanced without significantly increasing bonding complexity.
2Adaptability or versatility
If multiple pins are arranged for signal transmission, then signal transmission capability is improved, but bonding process complexity increases
Solution Approach 1:
The bonding structure uses a universal pin pair configuration where both test pins and function pins follow the same arrangement pattern and bonding procedure. This multi-functional design allows the same bonding process to serve multiple purposes: testing signal integrity through test pin pairs and transmitting control signals through function pin pairs, thereby reducing overall bonding process complexity.
Solution Approach 2:
Different regions of the pin arrangement serve different functions: test pin pairs are located at specific positions for signal integrity testing, function pin pairs are positioned for control signal transmission, and dummy pins are placed at ends for mechanical protection. This local differentiation optimizes each region's performance while maintaining an overall simple and systematic bonding structure.
3Stability of the object's composition
If dummy pins are added for bonding stability, then mechanical stability is improved, but device structure becomes more complex
Solution Approach 1:
Dummy pins are strategically positioned at the ends of the pin row to provide beforehand cushioning against mechanical stress and potential damage. These protective pins absorb external forces before they can reach the actual test and function pins, ensuring the stability and integrity of the functional bonding structure without requiring complex protective mechanisms.
Solution Approach 2:
The dummy pins serve as sacrificial or disposable elements that can be easily added and removed if needed. They provide mechanical protection during critical phases such as bonding and initial operation, but do not require complex integration into the long-term functional structure. This approach maintains bonding stability while minimizing permanent structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances signal transmission efficiency and mechanical stability between the FPC and display panel, improving the overall performance and reliability of the display apparatus.
Implementation Method 1
an adhesive layer disposed in the bonding region. A first test pin of a test pin pair of the plurality of test pin pairs is bonded to a second test pin of the test pin pair by the adhesive layer
Data Source
AI summary
A display module has a bonding region, and includes a first bonding component and a second bonding component. The first bonding component includes first test pins and first function pins that are disposed in the bonding region and arranged in a first direction. The second bonding component includes second test pins and second function pins that are disposed in the bonding region and arranged in the first direction. The second test pins and the first test pins are coupled to constitute test pin pairs, the second function pins and the first function pins are coupled to constitute function pin pairs, and the test pin pairs and the function pin pairs constitute a pin row. The first bonding component further includes at least one first dummy pin disposed in the bonding region, and a first dummy pin is located on an outer side of the pin row in the first direction.