Display Module Heat Dissipation Using Porous Fillers and Seating Grooves
Solution Overview
Problem
Heat dissipation in liquid crystal display modules is inefficient due to the placement of flexible printed circuit films between plastic components, leading to increased temperature and potential damage from vibrations.
Innovation Solution
Incorporating a heat dissipation unit with a porous filler and metal sheet on flexible printed circuit films to dissipate heat generated by the driver chip, and using graphite or aluminum heat sink plates to transfer heat from printed circuit boards to the bottom chassis, along with seating grooves to facilitate heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flexible printed circuit film is positioned between a middle mold and top chassis formed of plastics, then the structural assembly is completed, but heat generated at the driver IC cannot be dissipated, leading to an overall increase in temperature
Solution Approach 1:
A heat dissipation unit is introduced as an intermediary component between the driver IC and the top chassis. This heat dissipation unit includes a heat dissipation plate and a heat dissipation fin, which act as thermal mediators to conduct and dissipate heat away from the driver IC, preventing heat accumulation while maintaining the structural assembly integrity
Solution Approach 2:
The thermal conductivity parameter is improved by introducing metal-based heat dissipation components (heat dissipation plate and heat dissipation fin) with high thermal conductivity properties. This parameter change enables efficient heat transfer from the driver IC to the surrounding environment, resolving the heat dissipation issue while preserving the structural assembly
2Reliability
If heat is not dissipated efficiently from LEDs and driver ICs, then the display module operates normally, but temperature increases causing potential damage and reduced reliability
Solution Approach 1:
The heat dissipation unit serves as a thermal intermediary between the heat-generating components (LEDs and driver ICs) and the external environment. The heat dissipation plate conducts heat from the components, while the heat dissipation fin increases the surface area for heat exchange with the surrounding air, thereby maintaining operational reliability through effective thermal management
Solution Approach 2:
The heat dissipation fin extends the heat dissipation structure into a third dimension (vertical direction), increasing the surface area available for heat exchange. This dimensional expansion allows for more efficient heat dissipation without occupying additional horizontal space, thus maintaining reliability while controlling temperature
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces temperature differences and prevents damage by enhancing heat dissipation from LEDs and driver ICs, improving the overall thermal management of the display module.
Implementation Method 1
at least one heat dissipater disposed on an opposite surface of a corresponding one of the flexible printed circuit films which dissipates heat generated at the driver chip of the corresponding one of the flexible printed circuit films and provided with a porous filler attached therein
Implementation Method 2
at least one heat dissipater disposed on an opposite surface of a corresponding one of the flexible printed circuit films which dissipates heat generated at the driver chip
Implementation Method 3
using graphite or aluminum heat sink plates to transfer heat from printed circuit boards to the bottom chassis
Data Source
AI summary
A display module including a backlight to more effectively dissipate heat generated at light emitting diodes (LEDs) and heat dissipation units to effectively dissipate heat generated at driver chips and prevent movement of the driver chips by attaching porous fillers to the heat dissipation units, and a display apparatus having the same are provided. The display module includes a display panel, a backlight disposed on a rear side of the display panel and including a plurality of printed circuit boards, a bottom chassis adapted to accommodate the backlight unit and provided with a plurality of seating grooves, a driving printed circuit board, a plurality of flexible printed circuit films which electrically connect the display panel and the driving printed circuit board, at least one heat dissipater disposed on an opposite surface of a corresponding one of the flexible printed circuit and provided with a porous filler.