Display Module Support Layer for Crack-Resistant Flexible Bonding
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Solution Overview
Problem
The bonding process of flexible printed circuit boards with display panels in high temperature and high pressure conditions leads to uneven force distribution due to small mark areas and large step differences, causing cracks and affecting product reliability.
Innovation Solution
A support layer is introduced between the bonding segments of the display panel and flexible circuit board, with projections on the peripheral sides of the marks to reduce the step difference and distribute the pressing force more evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible bonding technology is used to connect the drive chip and display panel, then the display can achieve flexible form factors, but the high temperature and high pressure bonding process causes uneven force distribution and cracks around the marks
Solution Approach 1:
A support layer is introduced as an intermediary component between the display panel and flexible printed circuit board. This support layer provides additional structural reinforcement in the bonding region, distributing the high temperature and high pressure forces more evenly during the bonding process, thereby preventing cracks while maintaining flexible bonding capability
Solution Approach 2:
The support layer is pre-positioned around the marks before the bonding process begins. This preliminary structural preparation ensures that when high temperature and high pressure are applied, the force is already distributed through the support layer, preventing the uneven force distribution that would otherwise cause cracks
2Measurement precision
If the mark area is kept small for precise alignment, then alignment precision is improved, but the step difference between pressed surfaces increases and no support structure is present, causing cracks
Solution Approach 1:
The support layer is selectively positioned only around the mark regions where needed, providing localized reinforcement without affecting the overall small mark area. This local quality enhancement strengthens the vulnerable bonding regions while maintaining precise alignment capability
Solution Approach 2:
The support layer adds a third-dimensional structural element around the two-dimensional mark area. This vertical dimension provides additional support and distributes stress in a new spatial dimension, preventing cracks without interfering with the planar alignment precision of the marks
3Strength
If high temperature and high pressure are applied for bonding, then bonding strength is improved, but the force on the display panel near the mark becomes non-uniform, causing cracks
Solution Approach 1:
The support layer acts as a force-distributing intermediary between the bonding pressure source and the display panel. It receives the high temperature and high pressure bonding forces and redistributes them uniformly across the bonding interface, preventing localized stress concentrations that would cause cracks
Data Source
AI summary
Disclosed are a display module and a mobile terminal. The display module includes a first bonding segment of a display panel and a second bonding segment on a flexible circuit board, wherein a second bonding terminal on the second bonding segment corresponds to and is electrically connected to a first bonding terminal on the first bonding segment, and a second mark is disposed opposite to a first mark; a support layer is disposed between the first bonding segment and the second bonding segment, and a projection of the support layer in a direction perpendicular to the first bonding segment is disposed on a peripheral side of the first mark.