Display Module Thermal Management via Interconnected Heat Dissipation
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Solution Overview
Problem
Display devices using inorganic light emitting diodes face performance degradation due to high temperature heat generation, leading to non-uniform temperature distribution and image quality issues across the display panel.
Innovation Solution
A display device design featuring a matrix arrangement of display modules with module heat dissipation members and a panel heat dissipation member to evenly distribute heat across the substrate, maintaining thermal equilibrium and preventing temperature imbalances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If inorganic light emitting diodes are used for self-luminous display, then luminance and emission efficiency are improved, but high temperature heat is generated causing non-uniform temperature distribution and display performance degradation
Solution Approach 1:
The display panel is divided into multiple display modules arranged in an M×N matrix, with each module having its own substrate and heat dissipation member. This segmentation allows localized heat management while maintaining overall temperature uniformity across the entire display panel.
Solution Approach 2:
Module heat dissipation members are introduced as intermediary components between the inorganic light emitting diodes and the environment. These members conduct heat away from the LEDs and distribute it across the substrate, preventing localized overheating and non-uniform temperature distribution.
2Area of stationary object
If multiple display modules are arranged in parallel to form a large display panel, then screen size and resolution are improved, but heat accumulation increases causing temperature imbalances across different modules
Solution Approach 1:
Multiple display modules are merged into a unified display panel structure with coordinated heat dissipation. The module heat dissipation members work together with the panel heat dissipation member to create an integrated thermal management system that maintains temperature uniformity across all modules.
Solution Approach 2:
The heat dissipation design aims to achieve thermal equipotentiality across all display modules by providing equivalent heat dissipation pathways for each module. This ensures that temperature remains uniform across the entire panel, preventing temperature imbalances between different modules.
3Temperature
If heat dissipation members are added to manage temperature, then temperature uniformity is improved, but device complexity increases
Solution Approach 1:
The heat dissipation members serve multiple functions: they conduct heat away from the inorganic light emitting diodes, distribute heat uniformly across the substrate, and provide structural support for the display modules. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform image quality by maintaining consistent temperatures across the display panel, preventing luminance degradation and enhancing the reliability of the display device.
Implementation Method 1
the module heat dissipation member is provided as a vapor chamber that is provided to allow high temperature heat generated from one point on the substrate to be transferred to an entire area of the substrate in a direction parallel with the substrate
Implementation Method 2
the display panel includes a panel heat dissipation member connecting the module heat dissipation members of the plurality of display modules to dissipate heat between the module heat dissipation members
Data Source
AI summary
According to the present inventive concept, a display device includes a display panel in which a plurality of display modules are horizontally aligned in an M*N matrix, wherein each of the plurality of display modules includes: a mounting surface on which a plurality of inorganic light-emitting elements are mounted; a substrate including a back surface disposed opposite to the mounting surface; and a module heat-dissipation member in contact with the back surface of the substrate to dissipate heat generated in the substrate, wherein the display panel includes a panel heat-dissipation member which connects the respective module heat-dissipation members so as to dissipate heat between the respective module heat-dissipation members of the plurality of display modules.