Display Module Via Hole Signal Distribution for Micro LED Uniformity
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Solution Overview
Problem
The challenge in manufacturing display modules is achieving uniformity and efficiency in operation signals for micro LEDs, as differences in time and strength of signals applied to each micro LED can lead to inconsistent performance and reduced luminance across the display.
Innovation Solution
The solution involves a display module configuration with a thin film transistor substrate and a network of via holes and conductive layers that distribute gate and drain voltages uniformly across micro LEDs, ensuring consistent signal strength and timing through a grid arrangement of second via holes and conductive wirings, which are connected to first via holes and operation driver signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If operation signals are transmitted to micro LEDs at the same time from a driver, then the manufacturing process is simple, but differences in time and strength among operation signals applied to each micro LED occur
Solution Approach 1:
The patent segments the signal transmission path by introducing intermediate buffer components (first and second buffers) between the driver and micro LEDs. This segmentation allows the signal to be distributed in stages, with each buffer compensating for signal variations, thereby maintaining signal uniformity across multiple micro LEDs while keeping the overall manufacturing process simple.
Solution Approach 2:
The patent introduces intermediary buffer components (first buffer connected to gate electrode, second buffer connected to drain electrode) that act as mediators between the driver and micro LEDs. These buffers receive operation signals from the driver, hold them temporarily, and then transmit them to the respective micro LEDs, ensuring that signal strength and timing are uniform across all micro LEDs.
2Measurement precision
If a large number of micro LEDs are mounted on a display module, then high resolution display is achieved, but uniformity of operation signals becomes difficult to maintain
Solution Approach 1:
The patent divides the display module into multiple groups, with each group containing multiple micro LEDs connected to common gate and drain electrodes through shared buffers. This segmentation allows the operation driver to control each group uniformly while individual micro LEDs within a group receive uniform signals through the shared buffer, maintaining signal uniformity even when a large number of micro LEDs are mounted for high resolution display.
3Productivity
If micro LEDs are controlled through operation signals from a driver, then the display module operates efficiently, but signal variations cause inconsistent performance across micro LEDs
Solution Approach 1:
The patent introduces intermediary buffer components (first buffer between gate electrode and micro LED, second buffer between drain electrode and micro LED) that act as mediators to stabilize signal transmission. These buffers hold the operation signals and transmit them uniformly to the micro LEDs, ensuring that all micro LEDs receive consistent signal strength and timing, thereby improving performance consistency while maintaining operational efficiency.
Solution Approach 2:
The patent implements equipotentiality by using buffers to ensure that all micro LEDs within a group receive operation signals at the same potential level. The buffers compensate for signal strength variations and timing differences, creating uniform electrical conditions across all micro LEDs, which ensures consistent performance and luminance output.
Data Source
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AI summary
A display module is provided. The display module includes a substrate including a thin film transistor (TFT) layer including a plurality of TFTs, a plurality of light emitting diodes (LEDs) arranged on a front surface of the substrate, each LED corresponding to a respective TFT, and an operation driver that is connected to a rear surface of the substrate and controls an operation of the TFTs. The substrate includes a plurality of first via holes extending in a vertical direction from the front surface of the substrate to the rear surface of the substrate. The first via holes are filled with conductive materials and are distributively arranged based on at least one of the columns or rows of the plurality of LEDs. The first via holes connect the TFTs to the operation driver.