Display Device Opening Structure for Inorganic Insulator Crack Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The high-temperature and high-pressure stress during the mounting of a display driving circuit in display devices causes cracks in the inorganic insulating material, leading to oxygen and moisture permeation, resulting in corrosion and disconnection defects that significantly reduce the lifespan of the device.
Innovation Solution
A display device design that includes a circuit layer with a first opening overlapping the display driving circuit, featuring a main opening and a sub-opening extending from one side, and protrusions at the edge to reduce stress on the organic insulating material, protecting the inorganic insulating layers from deformation and cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the display driving circuit is mounted directly on the substrate using high-temperature and high-pressure processes, then the mounting reliability is improved, but cracks occur in the inorganic insulating material and conductive material, reducing device lifespan
Solution Approach 1:
The patent applies preliminary action by forming a stress relief structure (opening with rounded corners) in the circuit layer before mounting the display driving circuit. This pre-configured structure anticipates the stress that will occur during high-temperature and high-pressure mounting processes, allowing the stress to be distributed away from critical inorganic insulating material regions, thereby preventing cracks while maintaining mounting reliability
Solution Approach 2:
The patent segments the circuit layer by creating an opening that divides the continuous inorganic insulating material into separate regions. This segmentation prevents stress from propagating through the entire layer, localizing potential stress effects and preventing catastrophic crack formation that would compromise the overall integrity of the inorganic insulating material
2Reliability
If high-temperature and high-pressure stress is applied during mounting, then the display driving circuit is securely fixed, but oxygen and moisture permeate through cracks, causing corrosion and disconnection defects
Solution Approach 1:
The patent applies preliminary action by pre-forming the stress relief opening structure with rounded corners before the mounting process. This prevents crack formation that would otherwise create pathways for oxygen and moisture permeation, thereby eliminating the harmful effects of corrosion and disconnection defects while still achieving secure fixing through the mounting process
Solution Approach 2:
The patent converts the potentially harmful high-temperature and high-pressure stress into a beneficial outcome by designing the opening structure to redirect this stress away from critical areas. The stress that would normally cause cracks and enable harmful permeation is instead channeled through the opening structure, protecting the inorganic insulating material and preventing corrosion pathways
Data Source
AI summary
A display device includes: a substrate including a display area in which emission areas are arranged and a non-display area disposed around the display area; a circuit layer on the substrate; an element layer on the circuit layer; an encapsulation layer on the element layer; a touch sensor layer on the encapsulation layer; and a display driving circuit mounted in a part of the non-display area of the substrate. The circuit layer includes a gate insulating layer disposed on the substrate; an interlayer-insulating layer disposed on the gate insulating layer; and a planarization layer disposed on the interlayer-insulating layer. The circuit layer defines a first opening overlapping the display driving circuit and penetrating the planarization layer. The first opening includes a main opening overlapping the display driving circuit, and a first sub-opening extending from a first side, facing the display area, of an edge of the main opening.