Display Pixel Optical Layer Integration With Fewer Mask Steps
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Solution Overview
Problem
Current display device manufacturing methods face inefficiencies due to complex processes and high costs associated with multiple masks required for forming pixel circuits and optical layers, which hinder the production of high-quality display devices with improved performance.
Innovation Solution
A display device design that incorporates a substrate with a pixel circuit layer, insulating layers, and an optical layer, where the insulating layers are partially opened to expose the substrate, allowing for the continuous formation of the pixel circuit and optical layers, including a color filter and color conversion layers, thereby reducing the number of masks needed and enhancing manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple masks are used for forming pixel circuits and optical layers, then manufacturing precision can be maintained, but device complexity and manufacturing cost increase significantly
Solution Approach 1:
The patent combines the pixel circuit layer and optical layer into a single integrated structure. The pixel circuit layer serves as both the functional circuit layer and the structural base for the optical layer, eliminating the need for separate mask processes for each layer. This merging reduces the number of masks from multiple to fewer, while maintaining the precision required for both circuit and optical layer formation.
2Manufacturing precision
If multiple masks are used for forming pixel circuits and optical layers, then manufacturing precision can be maintained, but productivity decreases due to complex processes
Solution Approach 1:
By integrating the pixel circuit layer and optical layer formation into a single coordinated process using fewer masks, the patent reduces the total number of manufacturing steps. This merging eliminates the need for sequential mask applications for each layer, thereby improving productivity while maintaining the precision required for both layers.
3Manufacturing precision
If multiple masks are used for forming pixel circuits and optical layers, then manufacturing precision can be maintained, but manufacturing cost increases
Solution Approach 1:
The patent merges the formation processes of the pixel circuit layer and optical layer into a single integrated process using fewer masks. This reduction in the number of masks and process steps directly lowers manufacturing costs while maintaining the precision required for both layers through the coordinated formation approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and improves the efficiency of producing display devices with enhanced performance by integrating the pixel circuit and optical layers in a single step, leading to a more streamlined production method.
Implementation Method 1
a color filter layer between the color conversion layer and the first surface of the substrate in at least the emission area, and configured to selectively transmit light emitted from the color conversion layer to the second surface of the substrate
Implementation Method 2
a color conversion layer in the emission area to correspond to the light emitting element and including color conversion particles
Implementation Method 3
The second overcoat layer may include a material configured to block and absorb external light
Data Source
AI summary
A display device includes a substrate including a display area and a first surface and a second surface opposite each other; and pixels in the display area and including an emission area and a non-emission area, respectively. Each of the pixels may include: a pixel circuit layer including one or more transistors on the first surface of the substrate in the non-emission area, and a first insulating layer, a second insulating layer, a third insulating layer and a fourth insulating layers that are sequentially stacked on the first surface of the substrate and respectively include an opening exposing the first surface of the substrate in the emission area; an optical layer on the pixel circuit layer; and a light emitting element layer on the optical layer. The optical layer may fill the opening of each of the first to fourth insulating layers in at least the emission area.