Display Device Optical Layer Thickness Variation for Moisture Sealing
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Solution Overview
Problem
Current display devices face challenges in achieving improved reliability and effective protection against external factors such as water and moisture, particularly in the areas surrounding the circuit board and optical layer, which can lead to issues like corrosion and reduced performance.
Innovation Solution
A display device design that includes a display panel with a bonded circuit board, an optical layer with varying thickness regions, a light blocking pattern, and a protective layer to cover the circuit board, along with a method of manufacturing that involves attaching the optical layer to the display panel and applying a resin solution to fill the gap between the optical layer and the circuit board, ensuring the protective layer is formed to block external water and moisture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the optical layer has uniform thickness to simplify manufacturing, then manufacturing precision is improved, but the circuit board becomes exposed to water and moisture, reducing reliability
Solution Approach 1:
The optical layer is designed with different thicknesses in different regions: a first thickness in the first region and a second thickness (less than the first) in the second region that overlaps the circuit board. This local variation provides enhanced protection for the circuit board area while maintaining appropriate optical properties in the display area, resolving the contradiction between reliability and structural complexity.
2Length of stationary object
If the optical layer is made thinner overall to reduce device thickness, then device compactness is improved, but protection against external factors is reduced
Solution Approach 1:
The optical layer implements localized thickness variation where the second region overlapping the circuit board has a greater thickness than the first region. This allows the overall device thickness to be reduced while maintaining enhanced protection in the critical circuit board area, resolving the contradiction between compactness and protection.
3Reliability
If a thicker protective layer is applied to enhance sealing, then reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The optical layer is pre-formed with varying thickness regions before being assembled with the circuit board. The second region is designed with greater thickness in advance to provide sealing protection, eliminating the need for additional thick protective layers and simplifying the manufacturing process while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents external water and moisture from reaching the internal components, enhancing the reliability and longevity of the display device by creating a sealed environment around the circuit board and optical layer.
Implementation Method 1
applying a resin solution between the optical layer and the display panel through a gap between the optical layer and the circuit board
Implementation Method 2
The solution effectively prevents external water and moisture from reaching the internal components, enhancing the reliability and longevity of the display device by creating a sealed environment around the circuit board and optical layer
Data Source
AI summary
A display device includes a display panel. The display panel includes a display area including pixels and a non-display area adjacent to at least a side of the display area. A circuit board is bonded to at least a surface of the display panel that overlaps the non-display area in a plan view, the circuit board being electrically connected to the pixels. An optical layer is disposed on the display panel. The optical layer includes a first region having a first thickness and a second region having a second thickness less than the first thickness of the first region of the optical layer. The second region of the optical layer overlaps the bonded portion of the circuit board in a plan view.