Display Package Adhesion via Laser Welding and Adhesive Buffer
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Solution Overview
Problem
The existing electro-luminescent display packages face issues with moisture ingress due to unfavorable adhesion between the glass frit and substrates, leading to electrical characteristic degradation.
Innovation Solution
A display device package is designed with a welding glue and a first adhesive layer, where the materials of the two are different, forming a continuous or discontinuous pattern to enhance adhesion between substrates and prevent moisture entry, while the adhesive layer acts as a buffer against thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass frit is used to seal between array substrate and cover glass, then moisture prevention is improved, but adhesion between glass frit and substrates deteriorates
Solution Approach 1:
The patent introduces an adhesion promoter layer as an intermediary between the glass frit and the array substrate. This intermediate layer specifically enhances the bonding between glass frit and substrate materials, resolving the adhesion problem while maintaining the moisture barrier function of the glass frit seal.
Solution Approach 2:
The patent employs a composite sealing structure combining glass frit with adhesion promoter materials. This composite approach leverages the water-resistant properties of glass frit while incorporating materials optimized for strong adhesion to substrate surfaces, achieving both moisture prevention and strong bonding simultaneously.
2Object-affected harmful factors
If glass frit is used for laser sealing, then moisture resistance is improved, but gaps between glass frit and substrates occur leading to moisture ingress
Solution Approach 1:
The adhesion promoter layer acts as a mediator that fills and seals the gaps between glass frit and substrate surfaces. This intermediate material ensures complete coverage and eliminates pathways for moisture ingress, preventing electrical characteristic degradation while maintaining laser sealing capabilities.
Solution Approach 2:
The patent applies adhesion promoter material specifically at the critical interface regions where glass frit contacts the substrate. This localized application ensures complete gap sealing at the moisture ingress points while maintaining the overall structural integrity and optical properties of the display device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents moisture from entering the package, improves adhesion, and enhances the electrical characteristics and reliability of the display device by increasing the total adhesion area and providing better supportability.
Implementation Method 1
a laser is used to heat and melt the glass frit disposed between an array substrate and a cover glass
Implementation Method 2
heat and melt the glass frit disposed between an array substrate and a cover glass
Implementation Method 3
The first adhesive layer is adhered to the first substrate and the second substrate
Data Source
AI summary
An display device package including a first substrate, an display device, a second substrate, a welding glue, and a first adhesive layer is provided. The display device is disposed on the first substrate. The second substrate is disposed above the first substrate and the display device. The welding glue is welded with the first substrate and the second substrate and surrounds the display device, wherein the welding glue has a continuous pattern. The first adhesive layer is adhered to the first substrate and the second substrate, wherein the first adhesive layer is disposed between the display device and the welding glue and surrounds the display device, and the material of the first adhesive layer and the material of the welding glue are different.