Flexible Display Packaging Structure for LED Bubble Prevention
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Solution Overview
Problem
The challenge in manufacturing display devices is the formation of bubbles around light-emitting diodes due to insufficient packaging, which can compromise the reliability and efficiency of these devices as their size decreases.
Innovation Solution
A display device design that includes a flexible substrate, a bonding pad, a light-emitting diode, an encapsulant, and a support structure with an inclined surface, where the support structure's thickness near the light-emitting diode is greater than near the bonding pad, and a manufacturing method that involves forming an encapsulant and support structure materials to cover the light-emitting diode and bonding pad, respectively, while ensuring the support structure has a specific thickness and angle to prevent bubble formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the packaging material thickness is increased to ensure complete coverage of light-emitting diodes, then the protection and coverage are improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The packaging structure is divided into two functional segments: the encapsulant that provides optical encapsulation and the support structure that provides mechanical support and bubble prevention. This segmentation allows each component to be optimized independently, reducing overall complexity while maintaining complete coverage.
Solution Approach 2:
The support structure extends in the lateral dimension between the light-emitting diode and bonding pad, creating a three-dimensional configuration that prevents bubble formation without requiring excessive encapsulant thickness. This dimensional approach solves the coverage problem more efficiently.
2Reliability
If the support structure thickness is increased to prevent bubble formation, then the structural integrity is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The support structure exhibits local quality variation with greater thickness near the light-emitting diode where bubble prevention is most critical, and gradually decreasing thickness toward the bonding pad. This gradient design provides enhanced bubble prevention where needed while reducing manufacturing precision requirements in less critical areas.
3Reliability
If the encapsulant material is applied to cover the light-emitting diode completely, then the protection is improved, but the bubble formation risk increases due to material trapping
Solution Approach 1:
The support structure is formed beforehand to create a bubble-free zone before encapsulant application. This preliminary structural preparation prevents bubble formation during the encapsulation process by providing a scaffold that guides material flow and prevents entrapment.
Solution Approach 2:
The support structure acts as an intermediary element between the light-emitting diode and the encapsulant material. It mediates the encapsulation process by providing a lateral barrier that prevents excess material from trapping bubbles while still allowing complete coverage of the light-emitting diode.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents bubble formation, enhances the reliability of the display device by ensuring complete coverage and protection of the light-emitting diodes, and maintains the structural integrity of the device even after removal of the rigid carrier board.
Implementation Method 1
The encapsulant covers the light-emitting diode
Implementation Method 2
The support structure has an inclined surface, and a thickness of the support structure close to the light-emitting diode is greater than the thickness of the support structure close to the bonding pad
Data Source
AI summary
A display device includes a flexible substrate, a bonding pad, a light-emitting diode, an encapsulant, and a support structure. The bonding pad and the light-emitting diode are located on the flexible substrate. The encapsulant covers the light-emitting diode. The support structure is laterally located between the light-emitting diode and the bonding pad. The support structure has an inclined surface, and a thickness of the support structure close to the light-emitting diode is greater than the thickness of the support structure close to the bonding pad.