Display Panel Pad Bonding With Dual-Cure Conductive Adhesive
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Solution Overview
Problem
Existing electronic devices face challenges in preventing short-circuits between board pads that receive different signals, leading to unreliable electrical bonding.
Innovation Solution
An electronic device design featuring a conductive adhesive member with a first resin layer containing a photocuring agent and a second resin layer with a thermosetting agent, where conductive particles are dispersed, ensuring improved electrical bonding reliability by preventing short-circuits between pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single-layer conductive adhesive is used to connect pads, then the manufacturing process is simple, but short-circuits between adjacent pads cannot be prevented
Solution Approach 1:
The conductive adhesive is divided into two separate layers: a first conductive adhesive layer with first conductive particles and a second conductive adhesive layer with second conductive particles. This segmentation allows each layer to independently control electrical connections, preventing short-circuits between adjacent pads while maintaining reliable electrical bonding.
Solution Approach 2:
The invention uses composite conductive adhesive structures where two different conductive adhesive layers are stacked. The first layer contains conductive particles configured to prevent short-circuits, while the second layer provides additional electrical connection pathways, creating a composite material system that achieves both reliability and short-circuit prevention.
2Productivity
If the pitch between adjacent pads is reduced to increase component density, then more components can be integrated, but the risk of short-circuits between pads increases
Solution Approach 1:
By segmenting the conductive adhesive into two layers with different particle configurations, the invention enables closer pad spacing. The first layer's particles are arranged to bridge gaps between pads, while the second layer's particles provide additional connection pathways, allowing reduced pitch without increasing short-circuit risk.
Solution Approach 2:
The invention changes the parameters of the conductive adhesive system by using two layers with different particle sizes, shapes, or materials. This parameter variation allows optimization of electrical connection at reduced pad pitches, maintaining reliability while increasing component integration density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents short-circuits between pads, enhancing electrical connection characteristics and reliability, even when the pitch between adjacent pads is reduced.
Implementation Method 1
a first resin layer adjacent to the display panel, a second resin layer disposed between the first resin layer and the circuit board and having a curing agent different from that of the first resin layer
Implementation Method 2
a second resin layer disposed between the first resin layer and the circuit board and having a curing agent different from that of the first resin layer
Implementation Method 3
conductive particles disposed in the first resin layer wherein at least one of the second pads protrudes through the second resin layer and is in contact with the conductive particles
Data Source
AI summary
An electronic device includes a display panel having first pads, a circuit board that includes second pads corresponding to the first pads, and a conductive adhesive member disposed between the display panel and the circuit board to connect the first pads and the second pads, in which the conductive adhesive member includes a first resin layer adjacent to the display panel, a second resin layer disposed between the first resin layer and the circuit board and having a curing agent different from that of the first resin layer, and conductive particles disposed in the first resin layer wherein at least one of the second pads protrudes through the second resin layer and is in contact with the conductive particles.