Display Pad Data Conductive Layer Bonding Structure
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Solution Overview
Problem
Current display devices face challenges in achieving improved bonding characteristics in the pad region of the display device, particularly in the manufacturing process, which affects the reliability and performance of the display.
Innovation Solution
A display device with a specific wiring structure is developed, including a substrate with a data conductive layer composed of multiple layers such as a data base layer, data main metal layer, first data capping layer, and second data capping layer, where the second data capping layer is made of transparent conductive oxide like indium tin zinc oxide, and metal aggregates formed from inactive metals like silver, gold, or platinum are applied using a low-temperature heat treatment process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods are used in the pad region, then manufacturing processes are simpler, but bonding characteristics and reliability are insufficient
Solution Approach 1:
The data conductive layer is divided into multiple functional sub-layers: data base layer (adhesion), data main metal layer (conduction), first data capping layer (protection), and second data capping layer (transparent conductive oxide for bonding). This segmentation allows each layer to be optimized for its specific function, particularly improving bonding characteristics in the pad region while maintaining manufacturing feasibility
Solution Approach 2:
The patent employs a composite structure combining different materials with complementary properties: titanium base layer for adhesion, aluminum main metal layer for electrical conduction, titanium nitride capping layer for protection, and transparent conductive oxide (IGZO) for bonding characteristics. This composite approach resolves the contradiction by integrating materials that collectively provide both reliability and manufacturability
2Reliability
If high pressure and conductive balls are used to improve bonding, then bonding characteristics improve, but manufacturing complexity and pressure requirements increase
Solution Approach 1:
The transparent conductive oxide layer (IGZO) acts as an intermediary between the data main metal layer and external bonding structures. This intermediate layer provides excellent bonding characteristics without requiring high pressure or conductive balls, simplifying the manufacturing process while maintaining reliability
Solution Approach 2:
The patent changes the material parameter of the capping layer from conventional metals to transparent conductive oxide (IGZO), which fundamentally alters the bonding characteristics. This parameter change enables reliable bonding at lower pressures without requiring complex manufacturing processes involving conductive balls
3Reliability
If thicker metal layers are used to improve conductivity, then electrical performance improves, but bonding characteristics and manufacturing precision are compromised
Solution Approach 1:
The conductive function is segmented across multiple layers rather than relying on a single thick metal layer. The data base layer (titanium, 300-700 Å), data main metal layer (aluminum, 5000-20000 Å), and capping layers work together to achieve both electrical conductivity and bonding characteristics with controlled thicknesses that are manufacturable
Solution Approach 2:
The composite structure combines thin layers of different materials to achieve the desired electrical and bonding properties. The aluminum main metal layer provides conductivity while the titanium base layer and transparent conductive oxide capping layer provide adhesion and bonding characteristics, all with controlled thicknesses that balance performance and manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the bonding characteristics of the pad region without the need for conductive balls and at relatively low pressure, improving the overall performance and reliability of the display device.
Implementation Method 1
forming a metal aggregate by applying heat to the metal material layer such that metal included in the metal material layer is agglomerated
Implementation Method 2
metal included in the metal material layer is agglomerated
Data Source
AI summary
The present disclosure may provide display device and a method for manufacturing a display device. According to an embodiment, a display device includes a substrate including a display area and a pad area. The display device includes a data conductive layer disposed on the substrate in the pad area. The data conductive layer includes a data base layer, a data main metal layer disposed on the data base layer, a first data capping layer disposed on the data main metal layer, a second data capping layer disposed on the first data capping layer, and a plurality of metal aggregates disposed on the second data capping layer.