Display Module Pad Insulation Layout for Bonding Reliability

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Solution Overview

Problem

Existing display modules are prone to damage during bonding with a data driver, particularly affecting insulating films and signal pads, which compromises their reliability.

Innovation Solution

A display module design featuring insulating patterns and films with specific configurations to protect signal pads and insulating films, using organic and inorganic materials, and a conductive adhesive with conductive particles to enhance bonding reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If bonding process is performed between display module and data driver, then electrical connection is established, but damage occurs to insulating film and signal pads

Engineering Contradiction:

Improvebonding reliabilityVSAvoiddamage to insulating film and signal pads

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by pre-forming insulating patterns around signal pads before the bonding process. These insulating patterns are prepared in advance to prevent damage during subsequent bonding operations, thereby protecting the signal pads and insulating film while establishing electrical connections.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent introduces an insulating film as an intermediary layer between the display module and data driver during bonding. This intermediate insulating film acts as a protective barrier that prevents direct damage to the signal pads and underlying insulating structures while still allowing electrical connection through designated contact areas.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Stability of the object's composition

If insulating film is placed close to signal pads for structural support, then mechanical stability is improved, but risk of damage during bonding increases

Engineering Contradiction:

Improvestructural stabilityVSAvoiddamage risk during bonding

Core Design Contradiction:

Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by creating insulating patterns with specific spatial distribution - placing insulating material selectively around signal pads rather than uniformly everywhere. This localized insulation provides structural support where needed while maintaining safety margins that prevent damage during bonding operations.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The insulating patterns are formed in advance during the display module fabrication process, before bonding to the data driver. This preliminary formation of protective insulating structures ensures they are in place to prevent damage during the subsequent bonding operation, while providing the necessary structural stability.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS12598850B2Display module and an electronic device including the same

Publication Date: 2026.04.07 SAMSUNG DISPLAY CO LTD

AI summary

A display module including: a display panel including pixels arranged in a display area, first signal pads arranged in a non-display area and electrically connected to the pixels through signal lines, and second signal pads arranged in the non-display area and spaced farther from the display area than the first signal pads; first insulating patterns arranged at edges of the first signal pads; second insulating patterns arranged at edges of the second signal pads; and an insulating film disposed on the non-display area, wherein the insulating film is spaced apart from the first signal pads and the first insulating patterns, overlaps the edges of the second signal pads, and covers the second insulating patterns.