Display Panel Pad Layout for Bonding Resistance Testing
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Solution Overview
Problem
The existing display devices face challenges in reducing the area of the driver unit on the display panel due to the need for bonding resistance measurement pads, which can widen the driver area and affect the device's performance if not properly managed.
Innovation Solution
The display device incorporates a design with first and second input/output pads symmetrically arranged around a central imaginary line, with test pads and extending wires that allow for bonding resistance measurement without increasing the driver IC pad area, enabling the removal of test pads post-measurement to reduce the overall driver unit area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding resistance measurement pads are added to the display panel, then bonding resistance can be measured to test proper driving, but the driver area is widened
Solution Approach 1:
The measurement function is extracted from the main driver IC pad area and implemented separately through test pads connected via extending wires. The test pads are positioned in a location that does not overlap with the driver IC pad area, allowing bonding resistance measurement without widening the driver area.
Solution Approach 2:
Extending wires serve as intermediaries connecting the test pads to the driver IC pad area. These wires allow electrical connection for measurement purposes without requiring the test pads to be located within the driver IC pad area, thus maintaining area separation.
2Ease of manufacture
If test pads are integrated into the driver IC pad area, then bonding resistance measurement is enabled, but the driver unit area increases
Solution Approach 1:
The driver unit is segmented into functional components: the driver IC pad area for driving functions and a separate test pad area for measurement functions. This segmentation allows each component to occupy its designated space without encroaching on the other, maintaining compact overall design while enabling separate testing capability.
Solution Approach 2:
Instead of adding measurement functionality within the two-dimensional driver IC pad area, the test pads are positioned in a different spatial location and connected through extending wires, effectively utilizing the panel's extended area to avoid driver unit area increase.
Data Source
AI summary
A display panel includes pixels and a driver IC pad area; a driver IC on the driver IC pad area of the display panel; first input pads and first output pads that overlap the driver IC pad area; a flexible printed circuit adjacent to the driver IC pad area on the display panel; first output test pads that overlap the flexible printed circuit, and are respectively extended to the first output pads; and first input extending wires that overlap the flexible printed circuit, are respectively extended to the first input pads, and are between the first output test pads.