Display Pad Connection Wire Structure for Reliable Bump Bonding

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Solution Overview

Problem

The challenge in existing display devices is the low bonding reliability between pads and bumps, which affects the overall performance and durability of the display.

Innovation Solution

The display device incorporates a connection wire that directly contacts a supporter, with the connection wire covering the supporter, and a signal wire that overlaps the connection wire, enhancing the bonding reliability through a specific structural design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional bonding structure is used between pads and bumps, then the device complexity is low, but the bonding reliability is insufficient

Engineering Contradiction:
Improvebonding reliabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent introduces a connection wire as an intermediary component between the pad and the bump. This connection wire directly contacts both the pad and the bump, creating a reliable bonding structure. The connection wire acts as a mediator that enhances the bonding reliability while maintaining reasonable structural complexity through its specific geometric design with first, second, and third portions at different heights.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the connection wire covers the supporter, then the bonding reliability improves, but the manufacturing precision requirements increase

Engineering Contradiction:
Improvebonding reliabilityVSAvoidalignment precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent employs dimensional variation by creating a connection wire with multiple portions at different heights (first portion highest, second portion lowest, third portion intermediate). This three-dimensional structure allows the connection wire to cover the supporter effectively while providing tolerance for alignment during manufacturing, thus improving bonding reliability without excessively increasing manufacturing precision requirements.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If the signal wire directly contacts the connection wire, then the electrical conductivity improves, but the risk of short circuit increases

Engineering Contradiction:
Improveelectrical conductivityVSAvoidshort circuit risk
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by designing the connection wire with different portions at different heights. The first portion (highest) provides good electrical contact with the signal wire, while the second portion (lowest) and third portion (intermediate height) provide spatial separation and insulation. This localized variation in height ensures electrical conductivity where needed while preventing short circuits in other areas.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12527083B2Display device including connection wire and method for manufacturing the same
Publication Date: 2026.01.13 SAMSUNG DISPLAY CO LTD
  • US12527083B2 patent drawing
  • US12527083B2 patent drawing
  • US12527083B2 patent drawing

AI summary

A display panel comprising a display substrate having a display area and a pad area disposed around the display area. A connection wire is disposed on the pad area of the display substrate. A signal wire is disposed on the connection wire. A supporter is disposed between the display substrate and the connection wire. The connection wire directly contacts the supporter.