Display Device Pad-Bump Layout for Crack-Resistant Chip Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display devices face issues with cracks or damage when a driving chip is mounted on a substrate, particularly due to misalignment and improper electrical connections between the display panel and the driving chip.
Innovation Solution
The display device incorporates a driving chip with alternating output bumps and pads arranged in specific directions and distances to ensure precise alignment and electrical connectivity, using signal lines with distinct orientations to prevent overlap and enhance structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the driving chip is mounted on the substrate using conventional alignment methods, then the mounting process is simple, but cracks or damage occur due to misalignment between the driving chip and display panel
Solution Approach 1:
The patent introduces an intermediary alignment structure consisting of alignment marks formed on both the display panel and driving chip. These alignment marks serve as mediators that enable precise registration between the two components during mounting, eliminating misalignment-induced cracks without complicating the overall mounting process
Solution Approach 2:
The alignment marks are formed in advance on both the display panel and driving chip before the mounting process. This preliminary action ensures that when the components are brought together, precise alignment can be achieved quickly without requiring complex real-time adjustment mechanisms
2Manufacturing precision
If the output pads and output bumps are arranged in a conventional grid pattern, then the electrical connections are straightforward, but misalignment occurs during mounting
Solution Approach 1:
The patent employs an asymmetric arrangement where the output pads on the display panel and output bumps on the driving chip are positioned according to a specific non-uniform pattern. This asymmetric design, combined with corresponding alignment marks, ensures that even with manufacturing tolerances, the pads and bumps align correctly during mounting without requiring overly complex symmetric grid structures
3Area of stationary object
If signal lines are arranged densely to reduce area, then the display device is more compact, but cracks occur due to stress concentration
Solution Approach 1:
The patent applies local quality by varying the spacing and routing of signal lines in different regions. In areas prone to stress concentration, the signal lines are spaced more widely or routed to avoid creating stress points, while in other areas they can be densely packed. This localized adjustment maintains compactness where possible while preventing cracks in critical areas
Data Source
AI summary
A display device including a display panel and a driving chip. The display panel includes first row output pads and second row output pads. The driving chip includes first row output bumps and second row output bumps. Each of the first row output pads and the second row output pads includes first output pads and second output pads arranged alternately with the first output pads. Each of the first row output bumps and the second row output bumps includes first output bumps and second output bumps. The second output pads are shifted from the first output pads in a second direction by a predetermined or selected distance, and the second output bumps are shifted from the first output bumps in the second direction by a predetermined or selected distance.