Display Panel Pad Layout for Precise Driving Chip Alignment
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Solution Overview
Problem
Existing display devices face challenges in accurately aligning and measuring the position of driving chips on flexible display panels, particularly due to the variability in the size and shape of pads and chip pads, which can lead to manufacturing defects and reduced product reliability.
Innovation Solution
A display device design featuring a base layer with a circuit layer and pads arranged in an M×N matrix form, where the pads include first and second pads of different sizes, allowing for precise alignment and connection of driving chips through defined alignment and connection areas, facilitating easy measurement and attachment even with base layer expansion or contraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If pads and chip pads are made with variable sizes and shapes to accommodate different designs, then design flexibility is improved, but alignment measurement accuracy deteriorates
Solution Approach 1:
The pad structure is segmented into two distinct types: first pads with smaller areas and second pads with larger areas. This segmentation allows different pads to serve different functions - first pads for alignment measurement and second pads for electrical connection, thereby resolving the contradiction between design flexibility and measurement accuracy
Solution Approach 2:
Different regions of the pad structure are assigned different qualities and functions. First pads located in specific regions have smaller areas optimized for alignment measurement, while second pads in other regions have larger areas optimized for electrical connection. This local differentiation enables both measurement precision and design flexibility to coexist
2Reliability
If pads are made larger to ensure proper connection, then connection reliability is improved, but alignment measurement precision deteriorates
Solution Approach 1:
The connection function and measurement function are segmented into different pad types. Second pads with larger areas provide reliable electrical connection, while first pads with smaller areas provide precise alignment measurement. This functional segmentation resolves the contradiction between connection reliability and measurement precision
Solution Approach 2:
The pad structure achieves multi-functionality by incorporating both first pads and second pads. The first pads specialize in alignment measurement while second pads specialize in electrical connection, allowing the overall system to achieve both measurement precision and connection reliability simultaneously
3Adaptability or versatility
If the base layer is made flexible to enable folding applications, then adaptability is improved, but manufacturing precision deteriorates due to expansion and contraction
Solution Approach 1:
Alignment measurement is performed preliminarily during the manufacturing process while the base layer is in a stable state. This preliminary alignment measurement ensures precise chip placement before the flexible base layer undergoes expansion or contraction during use, thereby maintaining manufacturing precision despite the flexible nature of the substrate
Data Source
AI summary
A display device including a display panel including a base layer, a circuit layer disposed on the base layer, and a pad part having a plurality of pads disposed on the base layer; and a driving chip disposed on the pad part and including a plurality of chip pads. The plurality of pads include a first pad having a smaller area than a corresponding chip pad among the plurality of chip pads and a second pad electrically connected to the circuit layer.