Display Module Pad Connection Layout for Narrow Bezel Assembly
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Solution Overview
Problem
Existing display module manufacturing methods result in a significant width of non-display areas, which can detract from the overall display quality and increase the visibility of module boundaries.
Innovation Solution
A method involving the removal of a portion of the bending area and bending it such that the first and second contact holes overlap, allowing for the formation of a conductive part within these holes to connect the wiring layer and circuit member, thereby reducing the non-display area width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional manufacturing methods are used to assemble display panels with circuit members, then the electrical connection is established, but the width of the non-display area becomes significant and visible module boundaries appear
Solution Approach 1:
The patent applies dimensionality change by bending the flexible substrate in the thickness direction to bring contact holes from different lateral positions into vertical alignment. This transforms a lateral positioning problem into a vertical stacking problem, allowing electrical connections to be achieved through overlapping contact holes rather than through lateral routing, thereby reducing the non-display area width.
Solution Approach 2:
The patent segments the electrical connection path into multiple contact holes distributed across different regions of the flexible substrate. By dividing the connection function across multiple segmented contact holes that can be bent into alignment, the design achieves both compactness and electrical connectivity while reducing the visible non-display area.
2Manufacturing precision
If the non-display area width is reduced by bending the flexible substrate, then display quality is enhanced, but the alignment precision of contact holes becomes more difficult to achieve
Solution Approach 1:
The patent applies preliminary action by pre-forming the contact holes and designing their positions and sizes before the bending process. The contact holes are strategically positioned and dimensioned to ensure that when the flexible substrate is bent, they will naturally align vertically without requiring complex real-time adjustment during assembly.
Solution Approach 2:
The patent utilizes parameter changes by adjusting the bending radius, contact hole positions, and contact hole sizes to optimize alignment. By carefully controlling these parameters during the design and manufacturing stages, the patent achieves precise vertical alignment of contact holes after bending, balancing manufacturing precision with process feasibility.
3Reliability
If contact holes are formed to overlap after bending, then the non-display area is minimized, but the electrical connection stability may be compromised
Solution Approach 1:
The patent merges multiple contact holes into a vertically aligned stack after bending, combining their electrical connection functions into a single vertical pathway. This merging of multiple contact holes into an overlapping configuration ensures stable electrical connection while minimizing the lateral space required, thereby reducing the non-display area width.
Solution Approach 2:
The patent employs composite material structures by filling the overlapping contact holes with conductive materials that ensure reliable electrical connection. The combination of the flexible substrate, contact hole structures, and conductive fill materials creates a composite system that maintains electrical stability despite the reduced non-display area.
Data Source
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AI summary
A method of manufacturing a display module includes: providing a carrier substrate; providing a base layer (BL), where a display area and a pad area are defined, on the carrier substrate; providing a circuit layer on the display area of the base layer and the pad area of the base layer; forming a through hole in the circuit layer and the base layer on the pad area; forming a conductive part (CP) by providing a conductive material from an upper surface of the circuit layer to the through hole formed in the pad area; and providing a circuit member (CM) electrically connected to the circuit layer below the base layer.