Display Pad Contact Testing via Integrated Circuit Board Patterns

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Solution Overview

Problem

Existing display devices face challenges in ensuring complete and distortion-free connection between circuit boards and display panels, which affects the transmission of control and image signals.

Innovation Solution

A display device with a connection circuit board that includes a test pattern and sub-test patterns to verify the contact and bonding resistance of pads, ensuring accurate signal transmission by applying a test signal and measuring voltage across connected lines.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If pads are connected without testing, then manufacturing process is simple, but signal transmission reliability deteriorates

Engineering Contradiction:
Improvesignal transmission reliabilityVSAvoidtesting structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The test pattern is formed in advance during the manufacturing process, before actual signal transmission occurs. This preliminary formation of test structures allows for pre-verification of pad connections, ensuring reliability before the device is put into service.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The test pattern acts as an intermediary element between the first and second pads. By introducing this intermediate test structure, the patent enables indirect verification of pad connection quality without disrupting the primary signal transmission path.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If test pattern is added to verify pad contact, then connection reliability is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvepad contact precisionVSAvoidcircuit board structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The test pattern is merged with the existing circuit board structure and integrated into the manufacturing process. Rather than adding a separate testing device, the test functionality is combined with the circuit board itself, reducing overall system complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The test pattern serves multiple functions: it verifies pad connection quality, identifies manufacturing defects, and ensures signal transmission reliability. This multi-functionality reduces the need for separate testing mechanisms.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Productivity

If multiple lines are tested simultaneously, then testing efficiency is improved, but measurement accuracy may deteriorate

Engineering Contradiction:
Improvetesting efficiencyVSAvoidvoltage measurement precision
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The testing process is segmented into distinct measurement stages. The test pattern includes multiple lines that can be tested independently or in groups, allowing for systematic verification while maintaining measurement precision through structured testing sequences.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11741866B2Display device and pad contact test method thereof
Publication Date: 2023.08.29 SAMSUNG DISPLAY CO LTD
  • US11741866B2 patent drawing
  • US11741866B2 patent drawing
  • US11741866B2 patent drawing

AI summary

A display device includes a display panel, a main circuit board including a plurality of board pads arranged along a first direction, a connection circuit board electrically connected to the display panel and the main circuit board, and a driving chip disposed on the connection circuit board. The connection circuit board includes a plurality of board connection pads respectively connected to a plurality of board pads, a plurality of lines connecting the driving chip to the plurality of board connection pads to each other, and a test pattern disposed spaced part from the driving chip, where a first line and a second line among the lines are electrically connected to the test pattern, and a same voltage is applied to the first line and the second line.