Display Pad and Circuit Board Layout to Reduce Dead Space
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Solution Overview
Problem
Existing display devices have significant dead space where wires connect the driving chip to the display device, leading to reduced display quality due to non-visible areas.
Innovation Solution
A display device design with a substrate opening allowing a circuit board to be partially disposed beneath pads, connected through holes in an inorganic layer, reducing the need for bending and eliminating additional manufacturing processes for pad connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wires are disposed outside the display device to connect the driving chip, then electrical connection is achieved, but dead space area increases and display quality deteriorates
Solution Approach 1:
The patent transitions the wire connection from a two-dimensional external routing to a three-dimensional structure by disposing the circuit board within the display device thickness direction. The inorganic layer with holes provides vertical pathways for electrical connection, moving the connection space from the planar external area to the vertical internal volume, thereby eliminating dead space on the display surface.
Solution Approach 2:
The circuit board is nested within the display device structure, specifically positioned in the opening of the substrate. The inorganic layer with holes is nested between the circuit board and the pads, creating a compact hierarchical arrangement where multiple components occupy overlapping spatial volumes rather than requiring separate planar areas.
2Reliability
If additional manufacturing processes are added to form pads electrically connected to the circuit board, then connection reliability improves, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the formation of pads and holes in the inorganic layer into a single integrated structure. The pads are formed with protrusions that extend through the holes, combining the functions of electrical connection and structural support in one element. This eliminates the need for separate processes to create connection pathways and pad structures.
Solution Approach 2:
The inorganic layer with holes and pad protrusions is formed in advance during the display device manufacturing process, before the circuit board is disposed. This preliminary formation of connection structures simplifies subsequent assembly steps, as the electrical connection pathways are already prepared and integrated into the display device structure.
Data Source
AI summary
Provided is a display device including a substrate having an opening, a light emitting element disposed on the substrate, an inorganic layer disposed between the substrate and the light emitting element and having a plurality of holes overlapping the opening, pads disposed between the inorganic layer and the light emitting element and each partially exposed through the holes; and a circuit board at least partially disposed in the opening, spaced apart from the pads and the light emitting element with the inorganic layer interposed between the circuit board, and the pads and the light emitting element, and electrically connected to the pads exposed through the holes.