Display Pad Assembly With Heat Dissipation and Direct Pad Contact
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Solution Overview
Problem
Existing display devices face challenges in achieving ultra-high resolution with a simplified pad bonding structure and efficient heat dissipation, particularly in head-mounted displays like VR or AR glasses, where electrical connections and manufacturing processes are complex.
Innovation Solution
A display device design featuring a circuit substrate with pads connected to light emitting elements, a circuit board with corresponding pads, a heat dissipation substrate, and a cover substrate that mechanically fixes the circuit board and circuit substrate, eliminating the need for additional bonding materials and simplifying repair and manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complex pad bonding structure is used to achieve reliable electrical connections, then connection reliability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The invention extracts and eliminates the bonding material layer from the pad bonding structure, achieving direct physical contact between circuit board pads and circuit substrate pads. This removes the complexity of bonding processes while maintaining reliable electrical connections through direct metal-to-metal contact.
Solution Approach 2:
The cover substrate acts as an intermediary mechanical fixation structure that holds the circuit board and circuit substrate together without interfering with the direct pad contact. It provides structural support and alignment while allowing the pads to maintain direct physical and electrical connection.
2Strength
If additional bonding materials are used to secure components, then connection strength is improved, but ease of manufacture and repair deteriorate
Solution Approach 1:
The invention removes bonding materials from the connection structure, relying instead on direct physical contact between pads and mechanical fixation by the cover substrate. This simplifies manufacturing by eliminating bonding material application, curing, and inspection steps while maintaining strong electrical connections.
Solution Approach 2:
The pad structures are designed to self-align and self-contact when the cover substrate is installed, creating reliable electrical connections without requiring external bonding materials or complex assembly processes. The structure serves its own fixation and connection function.
3Ease of manufacture
If a simplified pad bonding structure is used, then ease of manufacture is improved, but connection reliability may deteriorate
Solution Approach 1:
The invention merges the electrical connection function and mechanical fixation function into a unified structure where the cover substrate simultaneously provides mechanical support and enables direct pad contact. This integration ensures reliable electrical connections through direct metal contact while maintaining manufacturing simplicity.
Solution Approach 2:
The invention employs precise geometric design of pad shapes and positions, along with corresponding alignment features on the cover substrate, to ensure accurate self-alignment and consistent contact. The geometric precision compensates for the absence of bonding materials, guaranteeing reliable electrical connections.
4Manufacturing precision
If complex bonding processes are used to achieve high resolution display, then display quality is improved, but productivity and manufacturing efficiency deteriorate
Solution Approach 1:
The invention eliminates bonding material application steps from the manufacturing process, reducing the number of process steps and cycle time. This directly improves manufacturing efficiency and productivity while maintaining the precision required for high-resolution display assembly through direct pad contact and mechanical fixation.
Data Source
AI summary
A display device includes: a circuit substrate including a plurality of pixel circuit units and a plurality of pads on a first surface thereof, the plurality of pads being electrically connected to the pixel circuit units; a display substrate on the circuit substrate and including a plurality of light emitting elements electrically connected to the pixel circuit units; a circuit board on the circuit substrate and including a plurality of circuit board pads electrically connected to the pads; a heat dissipation substrate on a second surface of the circuit substrate, the second surface being opposite to the first surface; and a cover substrate on the heat dissipation substrate and partially overlapping the circuit substrate and the circuit board. Each of the plurality of pads is in direct contact with at least one of the plurality of circuit board pads.