Display Pad Electrode Layout for High-Temperature Driver Connection
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Solution Overview
Problem
Existing display devices face challenges in achieving improved lighting efficiency and connection efficiency between pads and drivers, particularly in high-temperature environments.
Innovation Solution
The display device design includes a substrate with a specific arrangement of conductive layers and electrodes, where first and second pad electrodes overlap in one direction but not in a perpendicular direction, with equal or varying widths, and are connected through a buffer layer, enhancing the connection efficiency between pads and drivers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pad electrodes are arranged to overlap in plan view to improve connection efficiency, then connection efficiency between pads and drivers is improved, but device complexity increases
Solution Approach 1:
The pad electrodes are arranged to overlap in the thickness direction (vertical dimension) rather than only in the plan view (horizontal dimension). This dimensional transition allows multiple pad electrodes to be stacked vertically, improving connection efficiency without significantly increasing planar complexity. The first pad electrode and second pad electrode are positioned at different heights, creating a three-dimensional overlapping configuration that resolves the contradiction between connection efficiency and device complexity.
Solution Approach 2:
The pad electrodes are nested vertically within each other, with the second pad electrode positioned above the first pad electrode in the thickness direction. This nesting arrangement allows multiple functional layers to be compactly integrated, improving connection efficiency while maintaining a compact overall structure. The overlapping configuration enables one pad electrode to be effectively 'nested' within the vertical space occupied by another.
2Reliability
If inorganic light emitting diode is used to improve durability in high temperature environment, then durability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs multiple conductive layers with different material compositions and properties to optimize performance. The first conductive layer, second conductive layer, and third conductive layer are formed with varying materials and structures, allowing each layer to be manufactured within feasible precision tolerances while collectively achieving the desired high-temperature durability. This layered parameter optimization reduces the overall manufacturing precision burden compared to a single-layer approach.
Solution Approach 2:
The conductive structure is segmented into multiple separate layers rather than using a single monolithic structure. This segmentation allows each conductive layer to be manufactured and optimized independently, reducing the cumulative precision requirements. Each layer can be processed separately with standard manufacturing tolerances, avoiding the need for ultra-precise single-step fabrication required for monolithic high-temperature structures.
Data Source
AI summary
A display device includes a substrate including a display area and a pad area; a first conductive layer including a first pad electrode in the pad area; and a second conductive layer the second conductive layer includes a second pad electrode on the first pad electrode in the pad area; the first pad electrode and the second pad electrode overlap in a first direction that is a thickness direction, and do not overlap in a second direction perpendicular to the first direction.