Non-rectangular Display Device Pad and IC Spatial Separation
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Solution Overview
Problem
Existing display devices face design limitations due to the need for additional space when integrating a pad unit and an integrated circuit adjacent to each other, which restricts the shape and size of the display device, particularly in non-rectangular designs.
Innovation Solution
A non-rectangular display device design where the integrated circuit and the pad unit are spatially separated on different sides of an exposed area, with a flexible printed circuit board connecting them, allowing for a minimized area and enabling a narrower light-blocking portion in the cover window, thus reducing design constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the pad unit and integrated circuit are placed adjacent to each other, then the device can be compact, but the shape and size of the display device are restricted
Solution Approach 1:
The non-display area is divided into multiple separate regions (first region, second region, third region) rather than placing all components in one contiguous area. The pad unit and integrated circuit are spatially separated into different regions, allowing each to be positioned optimally without constraining the overall display shape.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional configuration by utilizing multiple layers and vertical stacking. The flexible printed circuit board bends and routes signals through multiple dimensions, enabling connections between separated regions without increasing the footprint area.
2Ease of manufacture
If additional space is allocated for pad unit and integrated circuit, then the components can be properly integrated, but the display area and overall device size are reduced
Solution Approach 1:
The pad unit and integrated circuit are nested within the non-display area regions, utilizing the existing space efficiently. The flexible printed circuit board is routed through multiple layers and bends to connect these nested components, allowing proper integration without requiring additional display area.
Solution Approach 2:
A flexible printed circuit board is used to connect the pad unit and integrated circuit, allowing the connections to be routed through tight spaces and around curves. This flexible routing enables proper component integration while minimizing the space required compared to rigid PCB designs.
3Adaptability or versatility
If the display device uses a non-rectangular shape, then design flexibility is improved, but the integration of pad unit and integrated circuit becomes more difficult
Solution Approach 1:
The non-rectangular display device is divided into multiple functional regions (display area, first region, second region, third region) that are clearly defined and separated. This segmentation allows the pad unit and integrated circuit to be placed in specific regions without complicating the overall non-rectangular design.
Solution Approach 2:
The flexible printed circuit board acts as an intermediary element that simplifies the integration of components in non-rectangular configurations. It provides a flexible routing path that adapts to the curved or angled boundaries of non-rectangular regions, making component placement and connection less complex.
Data Source
AI summary
A display device includes a first substrate that is non-rectangular and includes a display area having a plurality of pixels and a non-display area located around the display area, a second substrate that faces the first substrate and overlaps part of the first substrate, an integrated circuit that provides a driving signal to the pixels, and a first pad to which a flexible printed circuit board that delivers an external signal is coupled and which is electrically connected to the integrated circuit. The non-display area of the first substrate includes a first area that extends in a first direction and is exposed from the second substrate and a second area that extends in a second direction different from the first direction and is exposed from the second substrate. The integrated circuit is located in the first area. The first pad is located in the second area.