Display Pad Lateral Connection for Reduced Bezel Area
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Solution Overview
Problem
Existing display devices face challenges in reducing the bezel area and achieving aesthetically pleasing appearances due to the increased height difference caused by the attachment of flexible circuit films to exposed signal pads, which complicates the connection between the panel driver and display panel.
Innovation Solution
The display device design involves scribing and bonding first and second substrates, separating the end portion of a pad on the first substrate, and providing a connection electrode that is electrically connected to the pad at its lateral and lower surfaces, allowing the flexible circuit film to be attached to the lateral sides of the substrates instead of the upper surface, thus reducing the bezel area and eliminating the need for the substrates to extend out.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the flexible circuit film is attached to the exposed upper surface of the signal pad, then the connection between panel driver and display panel is established, but the bezel area increases and height difference is created
Solution Approach 1:
The patent transitions the attachment location from the upper surface (2D plane) to the lateral surface (3D edge), moving the connection interface to a different spatial dimension. This allows the flexible circuit film to be attached to the side of the substrate rather than extending the substrate outward, thereby reducing bezel area while maintaining connection reliability
Solution Approach 2:
Instead of extending the substrate outward to expose the pad for attachment (conventional approach), the patent inverts the approach by having the substrate extend downward and attaching the flexible circuit film to the lateral surface. This inversion eliminates the need for the substrate to extend outward, reducing bezel area while maintaining aesthetic appearance
2Reliability
If the flexible circuit film is attached to the exposed upper surface of the signal pad, then the electrical connection is established, but the aesthetic appearance deteriorates due to height difference
Solution Approach 1:
The attachment interface is moved from the upper surface to the lateral surface of the substrate, utilizing the side surface for connection. This dimensional change allows the flexible circuit film to be attached vertically rather than horizontally, eliminating height differences and improving aesthetic appearance while maintaining electrical connection integrity
Solution Approach 2:
The patent applies different structural configurations to different regions: the upper surface maintains a flush, planar structure for aesthetic purposes, while the lateral surface provides the attachment interface for the flexible circuit film. This local differentiation allows the majority of the display surface to remain aesthetically pleasing while still enabling reliable electrical connection
Data Source
AI summary
Disclosed is a display device and a method of manufacturing the same, wherein an end portion of a pad provided on a first substrate is spaced apart and separated from an upper surface of the first substrate, and a connection electrode electrically connected with the pad is in contact with a lateral surface of the pad and a lower surface of the pad.