Display Panel Pad Layout for Narrow-Bezel Signal Fan-Out
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Solution Overview
Problem
Existing display panels face challenges in reducing border width due to the increased number of signal lines and fan-out traces required for high-resolution displays, making it difficult to achieve narrow or borderless designs.
Innovation Solution
The electronic device employs a novel layout of output pads, input pads, auxiliary pads, and edge pad groups, along with first connection lines and conductive components, to efficiently connect signal lines, reducing the border width by optimizing the arrangement and connection of these components on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of signal lines is increased to achieve higher resolution, then the display resolution is improved, but the border width increases due to more fan-out traces being needed
Solution Approach 1:
The patent introduces edge pad groups arranged in a direction intersecting with the main signal line direction, and uses first connection lines to connect auxiliary pads to these edge pad groups. This creates a two-dimensional routing network that allows signal lines to exit the active area more efficiently, reducing the border width required for fan-out traces while maintaining high resolution connectivity.
2Adaptability or versatility
If the number of fan-out traces is increased to connect more signal lines to the driving chip, then the signal line connectivity is improved, but the border width increases
Solution Approach 1:
The patent segments the pad structure into multiple functional groups: output pads for the driving chip, auxiliary pads for additional connections, and edge pad groups positioned at the substrate edge. This segmentation allows different pad groups to handle different routing functions, enabling efficient signal distribution without requiring all fan-out traces to extend to the substrate edge, thus reducing border width.
Solution Approach 2:
The auxiliary pads and edge pad groups act as intermediary connection points between the output pads and the substrate edge. Instead of routing all signals directly from output pads to the edge, the intermediary pads provide intermediate connection stages, allowing signals to be distributed more compactly and reducing the required border width for fan-out traces.
Data Source
AI summary
An electronic device includes a substrate, output pads, input pads, auxiliary pads, a driving chip, edge pad groups, first connection lines, a first electronic component, and signal lines. The input pads and the auxiliary pads are closer to an edge of the substrate than the output pads. The edge pad groups are located between the driving chip and the edge of the substrate. Each of the edge pad groups includes a first pad and a second pad. Each of the first connection lines is electrically connected to one of the auxiliary pads and one of first pads of the edge pad groups. The first electronic component has conductive portions. The first pad and the second pad of each of the edge pad groups are electrically connected to one of the conductive portions. The signal lines are electrically connected to the output pads and second pads of the edge pad groups.