Display Panel Pad Layout to Prevent FPC Short Circuits

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Solution Overview

Problem

In micro OLED displays, the distribution of detection pads on the edge of the driving backplane can lead to short circuits when the flexible circuit board is bonded, causing abnormal display due to contact with both bonding and detection pads.

Innovation Solution

The display panel design includes a driving backplane with bonding pads located between sections, where the flexible circuit board is bonded between the first section and the pixel driving region, ensuring that it does not contact detection pads, thus preventing short circuits by positioning detection pads in a separate section along the edge of the driving backplane.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Difficulty of detecting and measuring

If detection pads are distributed along the edge of the driving backplane, then detection function is improved, but short circuit risk increases when flexible circuit board is bonded

Engineering Contradiction:
Improvedetection functionVSAvoidshort circuit risk
Core Design Contradiction:
Difficulty of detecting and measuringVSReliability

Solution Approach 1:

The edge of the driving backplane is divided into two distinct sections: a first section containing bonding pads for flexible circuit board connection, and a second section containing detection pads for detection functions. This segmentation physically separates the bonding and detection functions, allowing detection pads to be distributed along the edge for improved detection capability while preventing short circuits by isolating them from the bonding area.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The detection pads are extracted from the bonding area and placed exclusively in the second section along the edge of the driving backplane. This extraction ensures that the flexible circuit board can be bonded to the bonding pads in the first section without contacting the detection pads, thereby eliminating the short circuit risk while maintaining the detection function.

Inventive Principle:
Principle #2Taking out (Extraction)

2Ease of operation

If flexible circuit board is bonded to bonding pads on the edge, then bonding connection is improved, but contact with detection pads causes short circuits

Engineering Contradiction:
Improvebonding connectionVSAvoidshort circuit prevention
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The edge of the driving backplane is segmented into a first section for bonding pads and a second section for detection pads. This segmentation creates distinct functional zones that prevent the flexible circuit board from contacting detection pads during bonding, ensuring reliable bonding connection without short circuit risk.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The first section acts as an intermediary zone between the bonding pads and the detection pads in the second section. By positioning bonding pads in the first section adjacent to the pixel driving region, the design creates a spatial buffer that prevents direct contact between the flexible circuit board and detection pads, thereby eliminating short circuit risks while maintaining bonding connectivity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS11903298B2Display panel and display device
Publication Date: 2024.02.13 BOE TECHNOLOGY GROUP CO LTD
  • US11903298B2 patent drawing
  • US11903298B2 patent drawing
  • US11903298B2 patent drawing

AI summary

A display panel includes a driving backplane, a plurality of detection pads, a light emitting function layer, and a flexible circuit board. The driving backplane has a pixel driving region and a peripheral region, and the peripheral region has bonding pads; an edge of the driving backplane is surrounded by a first section and a second section, and the bonding pads are located between the first section and the pixel driving region; a plurality of detection pads are disposed in and distributed along the second section; a light emitting function layer is disposed on the driving backplane and located in the pixel driving region; a flexible circuit board extends between the first section and the pixel driving region, and is bonded to the bonding pads; a first packaging layer is disposed on the light emitting function layer.