Display Substrate Bonding Pad Layout for Light Shielding and Detection
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Solution Overview
Problem
Display substrates with gate lines reflect external light, affecting display quality and making it difficult to accurately identify bonding pads during quality detection.
Innovation Solution
A display substrate with a light shielding layer positioned below the gate lines to prevent light reflection, and the light shielding layer is not arranged under the bonding pads to ensure accurate identification during quality detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a light shielding layer is arranged below the gate lines to prevent light reflection, then display quality is improved, but bonding pads cannot be accurately identified during quality detection
Solution Approach 1:
The bonding pad structure is segmented into multiple layers: a first bonding pad layer extending beyond the light shielding layer for detection purposes, and a second bonding pad layer positioned over the light shielding layer for electrical connection. This segmentation allows the detection function to be separated from the light shielding function, enabling both light reflection prevention and accurate bonding pad identification.
Solution Approach 2:
The bonding pad structure transitions from a single-plane configuration to a multi-layer three-dimensional structure. The first bonding pad layer is positioned in a lower layer extending beyond the light shielding layer, while the second bonding pad layer is positioned in an upper layer. This dimensional change allows detection light to access the bonding pad from below the light shielding layer, resolving the contradiction between light shielding and detection accuracy.
2Object-affected harmful factors
If the light shielding layer covers the entire bonding area to maximize light reflection prevention, then display quality is improved, but bonding pads become invisible during quality detection
Solution Approach 1:
The bonding pad is divided into two functional segments: a first bonding pad layer that extends beyond the light shielding layer to serve as a detection target, and a second bonding pad layer that is covered by the light shielding layer to prevent light reflection. This segmentation allows different portions of the bonding pad structure to fulfill different functions simultaneously.
Solution Approach 2:
The first bonding pad layer acts as an intermediary element that bridges the light shielding layer and the detection system. It provides a detectable feature that extends beyond the light shielding layer, allowing the detection system to identify bonding pad positions without compromising the light shielding function of the upper layer.
3Object-affected harmful factors
If the bonding pad is positioned entirely within the light shielding layer to maximize light reflection prevention, then display quality is improved, but bonding pad identification during detection becomes abnormal
Solution Approach 1:
The bonding pad structure is segmented into a first bonding pad layer that extends beyond the light shielding layer and a second bonding pad layer that is covered by it. This segmentation allows the bonding pad to be positioned within the light shielding layer for optimal light reflection prevention while still providing an extending portion for accurate positioning and detection during manufacturing.
Solution Approach 2:
The first bonding pad layer extends beyond the light shielding layer to provide preliminary positioning references and detection targets before the complete multi-layer structure is assembled. This preliminary exposure facilitates accurate alignment and positioning during the manufacturing process, ensuring precise bonding pad placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The light shielding layer effectively prevents gate lines from reflecting light, improving display quality, and allows for accurate identification of bonding pads during quality detection.
Implementation Method 1
a light shielding layer disposed on a side of the first conductive layer proximal to the base, and an orthographic projection of the light shielding layer on the base at least covers an orthographic projection of the gate lines on the base
Data Source
AI summary
A display substrate, a method for manufacturing a display substrate and a display device are provided. The display substrate has a display area and a bonding area. The display substrate includes a base, a first conductive layer, a light shielding layer, and bonding pads. The first conductive layer is on the base and in the display area, and the first conductive layer includes gate lines; the light shielding layer is on a side of the first conductive layer proximal to the base, and an orthographic projection of the light shielding layer on the base at least covers orthographic projections of the gate lines on the base; the bonding pads are on the base at intervals and in the bonding area, orthographic projections of at least a portion of the bonding pads on the base are not overlapped with the orthographic projection of the light shielding layer on the base.