Display Panel Pad Limit Structure for LED Pin Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The contact surface between pins of a LED chip and pads in existing display panels is prone to displacement due to high temperature during soldering, leading to poor soldering and conductivity issues.
Innovation Solution
A display panel design featuring a limit assembly on the pad assembly with a thickness greater than the distance between the pin assembly, abutting against the pin assembly to prevent movement, and including limited members penetrating through solder paste layers to ensure precise soldering and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high temperature soldering process is used to join LED chip pins to pads, then soldering strength is improved, but contact surface displacement occurs leading to poor soldering quality
Solution Approach 1:
The limit assembly is pre-installed on the pad assembly before the LED chip is placed. This preliminary action establishes position limits for the pins before soldering occurs, preventing displacement during the high-temperature process while allowing the soldering to proceed with proper alignment
Solution Approach 2:
The limit assembly acts as an intermediary component between the pad assembly and the LED chip pins. It provides a mechanical constraint that mediates the interaction during soldering, ensuring the pins remain properly aligned with the pads while allowing the soldering process to achieve strong bonding
Data Source
AI summary
The present disclosure provides a display panel and a mobile terminal. The display panel includes a base substrate, a pad assembly, a pin assembly, and a limit assembly. An end of the limit assembly is fixedly connected with the pad assembly, another end of the limit assembly extends towards a side close to the pin assembly along a direction perpendicular to the base substrate, and a thickness of the limit assembly is greater than a distance between the pin assembly and the pad assembly. A side surface of the limit assembly is abutted against the pin assembly to prevent the pin assembly from moving.


