Display Panel Pad Layout for Insulated Test and Power Lines

The patent introduces a vertical stacking dimension by placing the panel-lighting-test line and power pad in different conductive layers (first and second conductive layers respectively). This multi-layer approach allows horizontal proximity for compact area while maintaining vertical electrical insulation through dielectric layers, effectively resolving the contradiction between area reduction and insulation reliability.

The patent employs dielectric layers (interlayer dielectric layer and encapsulation layer) as intermediary substances between the panel-lighting-test line and power pad. These dielectric materials provide electrical insulation while allowing the two conductive elements to be positioned close together horizontally, thus enabling compact design without compromising insulation reliability.

The patent combines multiple functional layers into an integrated multi-layer structure where conductive layers, interlayer dielectric layers, and encapsulation layers are formed together in a unified manufacturing process. This merging approach ensures electrical insulation reliability while managing structural complexity through systematic layer integration rather than separate assemblies.

By transitioning to a multi-layer vertical structure, the patent manages complexity through organized layer stacking rather than horizontal dispersion. The systematic arrangement of conductive and dielectric layers in the vertical dimension provides clear insulation pathways while maintaining a manageable overall structure that can be manufactured using standard multi-layer fabrication processes.