Display Module Pad Structure for Narrow-Bezel Electrical Connection
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Solution Overview
Problem
Existing display module designs have a significant non-display area that can detract from the overall display quality and visibility, as the width of this area is not adequately minimized, leading to a less immersive viewing experience and reduced display efficiency.
Innovation Solution
A method for manufacturing a display module with a reduced non-display area is developed, involving a carrier substrate with defined display and pad areas, where a conductive part is formed by creating overlapping holes in the circuit and base layers, allowing for a more compact design and improved electrical connectivity without the need for additional connection members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional mounting methods (COG or TAB) are used with separate connection members, then electrical connectivity is achieved, but the non-display area width increases
Solution Approach 1:
The patent merges the connection member and the display module into a single integrated structure. The circuit board serves dual functions as both the connection member for electrical connectivity and as part of the display module structure itself. This integration eliminates separate connection components and reduces the overall width of the non-display area while maintaining electrical connectivity between the display panel and driving chip.
Solution Approach 2:
The circuit board is designed to perform multiple functions: it acts as the connection member for electrical signals, provides structural support, and serves as part of the display module housing. This multi-functionality eliminates the need for separate dedicated connection members, thereby reducing the non-display area width while achieving both electrical connectivity and structural requirements.
2Area of stationary object
If the non-display area width is reduced, then display area ratio increases, but manufacturing precision requirements increase
Solution Approach 1:
By merging the connection member and display module, the patent reduces the number of separate components that need to be aligned and assembled. This integration simplifies the manufacturing process and reduces alignment precision requirements compared to traditional methods where separate connection members must be precisely positioned relative to the display panel.
Solution Approach 2:
The patent utilizes the thickness dimension (z-axis) to achieve electrical connectivity through the conductive holes, rather than relying solely on lateral expansion in the x-y plane. This dimensional approach allows for compact design with reduced non-display area width while maintaining necessary electrical connections, thereby reducing the impact of manufacturing precision requirements.
3Area of stationary object
If integrated design without separate connection members is used, then non-display area width is reduced, but electrical connectivity complexity increases
Solution Approach 1:
The integration of the circuit board as both connection member and display module component simplifies the overall electrical connection architecture. Instead of managing connections between separate independent components, the integrated design consolidates the electrical connection paths within a single unified structure, reducing the complexity of electrical connectivity management.
Data Source
AI summary
A method of manufacturing a display module includes: providing a carrier substrate; providing a base layer, where a display area and a pad area are defined, on the carrier substrate; providing a circuit layer on the display area of the base layer and the pad area of the base layer; forming a though hole in the circuit layer and the base layer on the pad area; forming a conductive part by providing a conductive material from an upper surface of the circuit layer to the though hole formed in the pad area; and providing a circuit member electrically connected to the circuit layer below the base layer.