Display Panel Pad Layout With Overlapping Circuit Board Coupling
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Solution Overview
Problem
Existing display devices face challenges in efficiently coupling circuit boards to display panels due to the need for sufficient space to apply bonding tools without interfering with driving chips, leading to increased dead space and reduced visibility.
Innovation Solution
The arrangement of pad electrodes on the left and/or right sides of driving chips, allowing the circuit board to overlap these areas without requiring additional space below, thereby reducing the width of the pad area and minimizing dead space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit board is coupled below the driving chips to provide signals and voltages to the display panel, then the electrical connection is established, but the width of the pad area increases and dead space is increased
Solution Approach 1:
The circuit board is positioned to overlap the pad area in the vertical dimension rather than being placed below the driving chips in the horizontal dimension. This dimensional change allows electrical connection while reducing the horizontal width of the pad area, thereby minimizing dead space and improving visibility.
2Ease of manufacture
If sufficient space is allocated below the display panel for bonding tools, then the manufacturing process can be completed, but the dead space increases and visibility is reduced
Solution Approach 1:
The circuit board is pre-positioned to overlap the pad area, which eliminates the need for additional horizontal space during the bonding process. This preliminary spatial arrangement allows bonding tools to access the connection area without requiring extra width, thus reducing dead space while maintaining ease of manufacture.
3Area of stationary object
If the pad area width is reduced to minimize dead space, then visibility is improved, but the space for coupling the circuit board becomes limited
Solution Approach 1:
The circuit board coupling is transitioned from a horizontal arrangement (below the display panel) to a vertical arrangement (overlapping the pad area). This dimensional change allows the pad area width to be reduced for improved visibility while still providing sufficient space for circuit board coupling through the vertical overlap configuration.
Data Source
AI summary
A display device that includes a substrate including a display area and a pad area disposed adjacent to a side of the display area; a driving chip disposed in the pad area in a first direction away from the side of the display area; a plurality of pad electrodes disposed in the pad area and arranged along a second direction perpendicular to the first direction; and a circuit board including a plurality of leading electrodes coupled to the plurality of pad electrodes, wherein a portion of the circuit board overlaps at least a portion of the pad area of the substrate.