Display Substrate Pad Opening Layout for Complete Gold Plating
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Solution Overview
Problem
The existing display substrate manufacturing process faces issues with low yield due to incomplete metal plating layers on conductive pads, caused by the first organic insulating layer exposing to the electroless gold plating solution, leading to poor electrical connections with light-emitting devices or driver chips.
Innovation Solution
The display substrate design includes a first organic insulating layer with openings corresponding to conductive pads and a first inorganic insulating layer with second openings, increasing the distance between the layers to prevent exposure and improve the coverage of the conductive anti-oxidation layer, thereby enhancing the yield by preventing contact with the electroless gold plating solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the first organic insulating layer is positioned close to the conductive pad, then the manufacturing process is simpler, but the metal plating layer becomes incomplete and electrical connection quality deteriorates
Solution Approach 1:
The patent introduces a first inorganic insulating layer as an intermediary barrier between the first organic insulating layer and the conductive pad. This intermediate layer prevents the organic insulating layer from directly exposing to the electroless gold plating solution, ensuring complete metal plating while maintaining manufacturing feasibility. The inorganic layer acts as a mediator that resolves the conflict between manufacturing simplicity and plating quality.
2Device complexity
If the first organic insulating layer is positioned close to the conductive pad, then the device structure is more compact, but the electrical connection reliability deteriorates due to poor metal plating
Solution Approach 1:
The first inorganic insulating layer serves as a mediator that enables the device to achieve both compact structure and reliable electrical connection. By positioning this intermediate layer between the organic insulating layer and the conductive pad, the design maintains close spacing for compactness while preventing plating defects that would compromise reliability.
Solution Approach 2:
The patent employs a composite insulating structure combining organic and inorganic materials. The first organic insulating layer provides insulation properties, while the first inorganic insulating layer adds a barrier function to prevent solution exposure. This composite approach allows the device to achieve both compact dimensions and reliable electrical connections through material combination rather than increasing overall size.
3Productivity
If the first organic insulating layer directly contacts the electroless gold plating solution, then the manufacturing process is faster, but the yield decreases due to incomplete metal plating
Solution Approach 1:
The first inorganic insulating layer is formed in advance before the electroless gold plating process. This preliminary action creates a protective barrier that prevents the organic insulating layer from exposing to the plating solution, ensuring complete metal plating coverage. By preparing this barrier layer beforehand, the process maintains speed while eliminating yield-reducing defects.
Data Source
AI summary
Provided is a display substrate. The display substrate includes a base substrate, a plurality of conductive pads, a first organic insulating layer, and a first inorganic insulating layer. The first organic insulating layer is disposed on the base substrate provided with the conductive pads and provided with a first opening corresponding to at least one conductive pad, and the first inorganic insulating layer is disposed on a side of the first organic insulating layer facing away from the base substrate and provided with a plurality of second openings corresponding to the plurality of conductive pads. An orthographic projection of at least one conductive pad on the base substrate is within an orthographic projection of the corresponding first opening on the base substrate, and an orthographic projection of the second opening on the base substrate is within the orthographic projection of the corresponding conductive pad on the base substrate.